This paper describes some recent innovations in design, process and materials in printed circuit laminate technology, which can lead to significant paradigm shifts in the design and application of electronic products. The traditional roles for printed circuit cards and boards have been to provide wiring interconnection capacity, and a robust mechanical structure for the more delicate and costly chips and modules. The advent of surface mount technology eliminated the need for plated‐through holes as anchors for pinned components. The proliferation of light, high performance, multifunction electronic products will lead to light weight, small, low profile printed circuit assemblies. Adding a redistribution layer to the traditional card surface allows flip‐chip‐on‐board and MCM‐L packages as a low‐cost alternative to traditional high density MCM packages, particularly in applications where size, shape and weight are as important as density and performance. Concurrent with the deliberate evolution of traditional printed circuit technology, some important new materials and process innovations have brought about a new generation of laminate capabilities that are particularly important for the future high I/O requirements predicted for the second part of this decade.
Access to this document was granted through an Emerald subscription provided by emerald-srm:463575 [] For AuthorsIf you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation.ABSTRACT-The fundamental considerations and mechanical integrity of printed circuit boards are reviewed, and mechanical analysis and modelling techniques provided. Fine line element techniques are utilised to model temperature distribution, thermally induced loading and moisture diffusion. Experimental testing techniques are used to make reliability assessment and to optimise material and processing developments.
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