This is a valuable book giving a good overview as well as a state-of-the-art account of several topics related to thermal aspects of electronic packaging. Chapter I, by Nakayama, is entitled: "Thermal Management of Electronic Equipment: A Review of Technology and Research Topics." The role of heat transfer engineering and fundamental research, toward establishing design criteria are discussed. An exposition of natural convection, forced convection and advanced schemes of cooling follows. An interesting account of the heat load in Japanese computers caps up the section. Yovanovich and Antonetti wrote the next Section on the application of thermal contact resistance theory to electronic packages. The study surveys mechanical joints and the role of surface roughness, crucial, for example, to the performance of various electrical connectors. Direct air cooling of electronic components is discussed by Moffat and Ortega under two major headings, 1. Forced Convection and II. Natural Convection. Analytical and numerical methods, and experimental data are presented in the first part.
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