This is a valuable book giving a good overview as well as a state-of-the-art account of several topics related to thermal aspects of electronic packaging. Chapter I, by Nakayama, is entitled: "Thermal Management of Electronic Equipment: A Review of Technology and Research Topics." The role of heat transfer engineering and fundamental research, toward establishing design criteria are discussed. An exposition of natural convection, forced convection and advanced schemes of cooling follows. An interesting account of the heat load in Japanese computers caps up the section. Yovanovich and Antonetti wrote the next Section on the application of thermal contact resistance theory to electronic packages. The study surveys mechanical joints and the role of surface roughness, crucial, for example, to the performance of various electrical connectors. Direct air cooling of electronic components is discussed by Moffat and Ortega under two major headings, 1. Forced Convection and II. Natural Convection. Analytical and numerical methods, and experimental data are presented in the first part.
A study has been made of the effect of chemical additives and of annealing and electrical biasing procedures upon the state of charge of silica films grown on silicon. A model, proposed to account for the observations, is based on the assumption that phosphorus, aluminum, and boron, when present, substitute for Si in SiC>.2. The resulting species may be represented as P0 2 +, P0 2 -, AI0 2 -, or B0 2 -. The mobile charge carrier in the silica under the conditions investigated here is assumed to be an oxide-ion vacancy. Under certain conditions electrolysis is accompanied by deviations from Faraday's laws and changes the net charge in the oxide; under other conditions only the charge distribution in the oxide is changed. The experiments leading to the development of the model, which were done with metal-oxide-silicon structures, have been supplemented with experiments with field effect transistors. Field effect transistors of the n-p-n type have been made to operate in the enhancement mode.
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