The aim of this research was to develop numerical modelling techniques for simulating the simultaneous effects of moisture, elevated temperature and applied load on the performance of adhesively bonded joints. Associated experimental data are also reported. The degradation process of the joints was modelled using a fully-coupled approach, with the moisture concentration affecting the stress distribution and the stress state affecting the moisture diffusion analyses simultaneously. Further, the stress analysis contains a moisture dependent creep model to accommodate viscous effects and both swelling and thermal strains were included in the simulation. The governing parameters adopted in the modelling procedure were determined from experimental work based on the bulk adhesive. The joint response was monitored throughout the ageing process and good correlation was found between the experimental and numerical results.
The aim of this research was to develop an experimental-numerical approach to characterize the effect of constant loading coupled with elevated temperature on epoxy bulk adhesive and predict the stress degradation of bulk adhesive specimen under 15% and 25% tensile failure load for automotive industry. A power-law creep model was built to simulate the effect of temperature and loading on adhesive mechanical behavior, and the related strength degradation simulation has also been implemented using a creep strain dependent ductile damage model. Experiments were conducted on bulk adhesive specimens under constant temperature coupled with mechanical load and the corresponding experimental results provided creep parameters for the simulation procedure as well as effective validation with the numerical results in this study. The results obtained from experiments and numerical simulations were also in good agreement.
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