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This study aims to deposit niobium nitride (NbN) thin films on stainless steel (SS304) and silicon (100) substrates using direct current (DC) magnetron sputtering method at different power (varied from 100 to 150 W). The film structure is analyzed by X-ray diffraction (XRD); the patterns show that the films possess a (111) preferred orientation, corresponding to the cubic structure phase. Rutherford elastic backscattering (RBS) and energy dispersive X-ray (EDX) are used to investigate the composition of the prepared films. Surface morphology of the films is explored by scanning electron microscopy (SEM) and atomic force microscopy (AFM) images. AFM images clarify modifications of the morphology, especially roughness versus increased power, where roughness decreased with increasing thickness as well as power. Corrosion and microhardness performances of the films are related and assigned to the crystallinity of samples, which varies with power. Corrosion resistance of NbN films associated with SS304 substrates is improved. These attractive results may allow to use our films in the field of medical tools or equipment (equivalent to saline serum media). Electrical measurements (C-V and I-V) of films deposited at a power of 100 W confirm the potential electrical applications of NbN films deposited by DC sputtering method.