Aluminum and gold nanowires were fabricated using 100 mm stencil wafers containing nanoslits fabricated with a focused ion beam. The stencils were aligned and the nanowires deposited on a substrate with predefined electrical pads. The morphology and resistivity of the wires were studied. Nanowires down to 70 nm wide and 5 µm long have been achieved showing a resistivity of 10 µΩcm for Al and 5 µΩcm for Au and maximum current density of ∼10 8 A/cm 2 . This proves the capability of stencil lithography for the fabrication of metallic nanowires on a full wafer scale.An important objective in nanotechnology is the development of alternative nanopatterning methods and the fabrication of novel nanoscale structures and materials. Among such structures, nanowires (NWs) have shown potential and applications in a broad range of fields such as electronics, 1,2 magnetic memories, 3 thermoelectric, 4,5 nanomechanical, 6 optoelectronic, 7 and biosensing devices 8-10 due to their physical properties and surface to volume ratio. In particular, metallic nanowires can be applied for interconnects, magnetic memories based on spin-polarized current 3 and biosensors. 9 To fabricate NWs, the two approaches used are the chemical synthesis (bottom-up) and the nanopatterning methods (topdown).

A quantitative analysis of blurring and its dependence on the stencil-substrate gap and the deposition parameters in stencil lithography, a high resolution shadow mask technique, is presented. The blurring is manifested in two ways: first, the structure directly deposited on the substrate is larger than the stencil aperture due to geometrical factors, and second, a halo of material is formed surrounding the deposited structure, presumably due to surface diffusion. The blurring is studied as a function of the gap using dedicated stencils that allow a controlled variation of the gap. Our results show a linear relationship between the gap and the blurring of the directly deposited structure. In our configuration, with a material source of ∼5 mm and a source-substrate distance of 1 m, we find that a gap size of ∼10 μm enlarges the directly deposited structures by ∼50 nm. The measured halo varies from 0.2 to 3 μm in width depending on the gap, the stencil aperture size and other deposition parameters. We also show that the blurring can be reduced by decreasing the nominal deposition thickness, the deposition rate and the substrate temperature.

The development of nanoscale lithographic methods on polymer materials is a key requirement to improve the spatial resolution and performance of flexible devices. Here, we report the fabrication of metallic nanostructures down to 20 and 50 nm in size on polymer materials such as polyimide, parylene, SU-8, and PDMS substrates without any resist processing using stencil lithography. Metallic nanodot array analysis of their localized surface plasmon spectra is included. We demonstrate plasmon resonance detection of biotin and streptavidin using a PDMS flexible film with gold nanodots. We also demonstrate the fabrication of metallic nanowires on polyimide substrates with their electrical characteristics showing an ohmic behavior. These results demonstrate high-resolution nanopatterning and device nanofabrication capability of stencil lithography on polymer and flexible substrates.

A new and versatile technique for the wafer scale nanofabrication of silicon nanowire (SiNW) and multiwalled carbon nanotube (MWNT) tips on atomic force microscope (AFM) probes is presented. Catalyst material for the SiNW and MWNT growth was deposited on prefabricated AFM probes using aligned wafer scale nanostencil lithography. Individual vertical SiNWs were grown epitaxially by a catalytic vapor-liquid-solid (VLS) process and MWNTs were grown by a plasma-enhanced chemical vapor (PECVD) process on the AFM probes. The AFM probes were tested for imaging micrometers-deep trenches, where they demonstrated a significantly better performance than commercial high aspect ratio tips. Our method demonstrates a reliable and cost-efficient route toward wafer scale manufacturing of SiNW and MWNT AFM probes.

One of the major advantages of stencil lithography is the possibility to use stencils many times. However, when stencils contain nanoapertures, the clogging of the membranes limits the useful life time of the stencils. The clogging is due to the accumulation of material deposited inside the apertures of the stencil. Here, we report a study on the effect of the clogging on the life time of stencils after Al depositions through the stencils. Then we present a method to clean the stencils based on Al wet etching to eliminate the clogging. We show that this method allows the reusability of stencils for the repeatable depositions of Al nanostructures.