Copper wire has been introduced to replace gold or aluminum wires and gets a lot of attention due to advantages below:
I.Copper wire material cost is much lower than gold wire.
2.Faster UPH compared to aluminum wire bonder.
3.Better electrical perfonnance in comparison with gold or aluminum wires.
4.Better thennal perfonnance than gold or a1uminmn wires.To further understand the behavior and limitation about the Cu-AI system. it is essential to investigate the the reliability of the Cu wire bonds under stress.especially with current demanding applications within consumer and automotive markets. The objective of tIus investigation is to evaluate the wire bonding reliability of Cu wires on AI based metallizations in comparison with Au wires. Metallurgical analysis was also carried out to assess the interface reliability after thennal storage.
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