The ASML EUV alpha demo tool is operational! The alpha demo tool is a 0.25NA fully functional lithography tool with a field size of 26 33 mm 2 , enabling process development at the 40-nm technology node. In this paper we describe the tool performance, show that vacuum is achieved in a few hours, and demonstrate that our optics contamination strategy mitigates degradation of the optics. Additional data shows the Sn source cost-of-ownership to be comparable to state-of-the-art ArF source systems, by implementing a collector contamination mitigation strategy that includes cleaning. And, we present our first 35-nm dense lines and spaces (half pitch) resist images.

The extreme ultraviolet (EUV) Engineering Test Stand (ETS) is a step-and-scan lithography tool that operates at a wavelength of 13.4 nm. It has been developed to demonstrate full-field EUV imaging and acquire system learning for equipment manufacturers to develop commercial tools. The initial integration of the tool is being carried out using a developmental set of projection optics, while a second, higher-quality, projection optics is being assembled and characterized in a parallel effort. We present here the first lithographic results from the ETS, which include both static and scanned resist images of 100 nm dense and isolated features throughout the ring field of the projection optics. Accurate lithographic models have been developed and compared with the experimental results.

ASML has built and shipped to The College of Nanoscale Science and Engineering of the University at Albany (CNSE) and IMEC two full field step-and-scan exposure tools for extreme ultraviolet lithography. These tools, known as Alpha Demo Tools (ADT), will be used for process development and to set the foundation for the commercialization of this technology. In this paper we will present results from the set-up and integration of both ADT systems, status of resist and reticles for EUV, and the plans for using these tools at the two research centers. We will also present the first resist images from one of the tools at the customer site, and demonstrate 32nm half-pitch dense lines/spaces printing as well as 32nm dense contact hole printing.

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