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Potentially high-performance lithium metal cells in extreme high-temperature electrochemical environments is a challenging but attractive battery concept that requires stable and robust electrolytes to avoid severely limiting lifetimes of the cells. Here, the properties of tailored polyester and polycarbonate diols as the soft segments in polyurethanes are investigated and electrochemically evaluated for use as solid polymer electrolytes in lithium metal batteries. The polyurethanes demonstrate high mechanical stability against deformation at low flow rates and moreover at temperatures up above 100 °C, enabled by the hard urethane segments. The results further indicate transferrable ion transport properties of the pure polymers when incorporated as the soft segments in the polyurethanes, offering designing opportunities of the polyurethane by tuning the soft segment ratio and composition. Long-term electrochemical cycling of polyurethane-containing cells in lithium metal batteries at 80 °C proves the stability at elevated temperatures as well as the compatibility with lithium metal with stable cycling maintained after 2000 cycles.

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A series of soluble, fully aromatic polyetherimides were prepared as candidate materials for optical coating applications. Most of the new polymer coatings possessed high transparency in the optical and near-infrared spectral regions at thicknesses ranging from 1 to 10 microns. The refractive indices obtained ranged from 1.60 to 1.80 at visible wavelengths, with the highest values generally being obtained near 400 nm followed by a gentle decline as wavelength increased to 700 nm and beyond. The refractive index values could be controlled by varying the dianhydride and diamine composition. All of the polyimides showed good thermal stability to 400°C and displayed glass transition temperatures above 220°C, making them excellent candidates for device applications where increased refractive index and high optical clarity are desired. The paper will discuss the preparation and physical and optical properties of the polymers and compare them to other high index coating systems.

Microelectromechanical systems (MEMS) device manufacturers today are faced with the challenge of protecting electronic circuitry and other sensitive device structures during deep silicon wet-etch processes. Etch processes of this nature require prolonged exposure of the device to harsh corrosive mixtures of aqueous acids and bases at higher than ambient temperatures. A need exists for a spin-applied polymeric coating to prevent the exposure of such circuitry against the corrosive etchants. The challenge exists in developing protective coatings that will not decompose or dissolve in the etchants during the etch process. Such coatings require superior adhesion to the substrate without destroying the sensitive features below. Brewer Science, Inc., has developed a multilayer coating system for basic etchants which is compatible with a variety of semiconductor materials and offers protection against concentrated potassium hydroxide (KOH) etchants at prolonged exposure times of more than 8 hours. In addition, a second multilayer coating system is being developed for use with strong hydrofluoric and other various mixed acid etchants (MAEs) for exposures of 30 minutes or longer. These materials are specifically designed to protect circuitry subjected to concentrated MAEs during the wafer thinning processes used by MEMS device manufacturers.

We describe here performance enhancements provided by an anti‐reflective coating (ARC), developed for deep UV applications. The reduction in substrate reflections provided by the ARC layer results in significant increases in resolution capability and process latitude compared to single layer deep UV resist. Increased linewidth control and patterning capability for highly reflective, grainy, and topographical substrates is demonstrated.

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We are developing a set of dyed red, green, and blue color filter coatings for the fabrication of high resolution CCD and CMOS image sensor arrays. The resists contain photosensitive polymer binders and various curing agents, soluble organic dyes, and solvents. The new dyed photoresists are sensitive to i-line radiation, primarily at 365 nm, and are negative-working, requiring less than 500 mJ of exposure energy for patterning. The coatings are developed in standard Tetramethylammonium Hydroxide (TMAH) developers. Many dyes were examined in order to achieve the desired spectral properties as well as the meet the solvent solubility and thermal stability requirements. Computer modeling was utilized to determine the correct proportions of dye(s) in each resist, after which the modeling results were verified by actual formulation and testing. Thermal stability of the dyes was determined using isothermal. Thermogravimetric Analysis (TGA) at 200 o C for 30 minutes. The dyes were evaluated in both traditional (free radical) and novel polymer systems to see if adequate sensitivity, resolution, and feature quality could be obtained. The studies showed that traditional free radical-based photochemistries are marginal at best for high resolution (1-2 micron) applications. To overcome this limitation, a new polymer system having photodimerizable functional units and acid functional groups was developed to impart photosensitivity and developer solubility, respectively. This system, which does not use free radical-initiated photopolymerization as a mechanism for patterning, shows low exposure dose requirements and is capable of resolving features less than 2 micron in size.