Vertical heterojunction NiO/β n-Ga2O/n+ Ga2O3 rectifiers employing NiO layer extension beyond the rectifying contact for edge termination exhibit breakdown voltages (VB) up to 4.7 kV with a power figure-of-merits, VB2/RON of 2 GW·cm−2, where RON is the on-state resistance (11.3 mΩ cm2). Conventional rectifiers fabricated on the same wafers without NiO showed VB values of 840 V and a power figure-of-merit of 0.11 GW cm−2. Optimization of the design of the two-layer NiO doping and thickness and also the extension beyond the rectifying contact by TCAD showed that the peak electric field at the edge of the rectifying contact could be significantly reduced. The leakage current density before breakdown was 144 mA/cm2, the forward current density was 0.8 kA/cm2 at 12 V, and the turn-on voltage was in the range of 2.2–2.4 V compared to 0.8 V without NiO. Transmission electron microscopy showed sharp interfaces between NiO and epitaxial Ga2O3 and a small amount of disorder from the sputtering process.
The band alignment of sputtered NiO on β-Ga2O3 was measured by x-ray photoelectron spectroscopy for post-deposition annealing temperatures up to 600 °C. The band alignment is type II, staggered gap in all cases, with the magnitude of the conduction and valence band offsets increasing monotonically with annealing temperature. For the as-deposited heterojunction, ΔE V = −0.9 eV and ΔE C = 0.2 eV, while after 600 °C annealing the corresponding values are ΔE V = −3.0 eV and ΔE C = 2.12 eV. The bandgap of the NiO was reduced from 3.90 eV as-deposited to 3.72 eV after 600 °C annealing, which accounts for most of the absolute change in ΔE V−ΔE C. Differences in thermal budget may be at least partially responsible for the large spread in band offsets reported in the literature for this heterojunction. Other reasons could include interfacial disorder and contamination. Differential charging, which could shift peaks by different amounts and could potentially be a large source of error, was not observed in our samples.
Optimized vertical heterojunction rectifiers with a diameter of 100 µm, consisting of sputter-deposited p-type NiO forming a p–n junction with thick (10 µm) Ga2O3 drift layers grown by halide vapor phase epitaxy (HVPE) on (001) Sn-doped (1019 cm−3) β-Ga2O3 substrates, exhibited breakdown voltages >8 kV over large areas (>1 cm2). The key requirements were low drift layer doping concentrations (<1016 cm3), low power during the NiO deposition to avoid interfacial damage at the heterointerface and formation of a guard ring using extension of the NiO beyond the cathode metal contact. Breakdown still occurred at the contact periphery, suggesting that further optimization of the edge termination could produce even larger breakdown voltages. On-state resistances without substrate thinning were <10 mΩ.cm−2, leading to power figure-of-merits >9 GW.cm−2. The devices showed an almost temperature-independent breakdown to 600 K. These results show the remarkable potential of NiO/Ga2O3 rectifiers for performance beyond the limits of both SiC and GaN. The important points to achieve the excellent performance were: (1) low drift doping concentration, (2) low power during the NiO deposition and (3) formation of a guard ring.
β-Ga2O3 is an emerging ultra-wide bandgap semiconductor, holding a tremendous potential for power-switching devices for next-generation high power electronics. The performance of such devices strongly relies on the precise control of electrical properties of β-Ga2O3, which can be achieved by implantation of dopant ions. However, a detailed understanding of the impact of ion implantation on the structure of β-Ga2O3 remains elusive. Here, using aberration-corrected scanning transmission electron microscopy, we investigate the nature of structural damage in ion-implanted β-Ga2O3 and its recovery upon heat treatment with the atomic-scale spatial resolution. We reveal that upon Sn ion implantation, Ga2O3 films undergo a phase transformation from the monoclinic β-phase to the defective cubic spinel [Formula: see text]-phase, which contains high-density antiphase boundaries. Using the planar defect models proposed for the [Formula: see text]-Al2O3, which has the same space group as β-Ga2O3, and atomic-resolution microscopy images, we identify that the observed antiphase boundaries are the {100}1/4 ⟨110⟩ type in cubic structure. We show that post-implantation annealing at 1100 °C under the N2 atmosphere effectively recovers the β-phase; however, nano-sized voids retained within the β-phase structure and a [Formula: see text]-phase surface layer are identified as remanent damage. Our results offer an atomic-scale insight into the structural evolution of β-Ga2O3 under ion implantation and high-temperature annealing, which is key to the optimization of semiconductor processing conditions for relevant device design and the theoretical understanding of defect formation and phase stability.
The topological kagome metal CoSn hosts orbital-selective Dirac bands and very flat bands near the Fermi energy that lead to a range of exotic phenomena, such as fractional quantum Hall states. In this work, we report the synthesis of high-quality epitaxial (0001) CoSn films by magnetron sputtering. Comprehensive structural characterizations demonstrate high crystalline quality with low disorder, sharp interfaces, and a smooth surface. Complementary magnetic and transport properties show a paramagnetic, metallic ground state as seen in bulk. Our work creates a synthetic foundation to investigate and utilize rich topological physics in CoSn thin films and heterostructures.
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