NiO/β-Ga2O3 vertical rectifiers exhibit near-temperature-independent breakdown voltages (VB) of >8 kV to 600K. For 100 µm diameter devices, the power figure of merit (VB)2/ RON, where RON is the on-state...

Optimized vertical heterojunction rectifiers with a diameter of 100 µm, consisting of sputter-deposited p-type NiO forming a p–n junction with thick (10 µm) Ga2O3 drift layers grown by halide vapor phase epitaxy (HVPE) on (001) Sn-doped (1019 cm−3) β-Ga2O3 substrates, exhibited breakdown voltages >8 kV over large areas (>1 cm2). The key requirements were low drift layer doping concentrations (<1016 cm3), low power during the NiO deposition to avoid interfacial damage at the heterointerface and formation of a guard ring using extension of the NiO beyond the cathode metal contact. Breakdown still occurred at the contact periphery, suggesting that further optimization of the edge termination could produce even larger breakdown voltages. On-state resistances without substrate thinning were <10 mΩ.cm−2, leading to power figure-of-merits >9 GW.cm−2. The devices showed an almost temperature-independent breakdown to 600 K. These results show the remarkable potential of NiO/Ga2O3 rectifiers for performance beyond the limits of both SiC and GaN. The important points to achieve the excellent performance were: (1) low drift doping concentration, (2) low power during the NiO deposition and (3) formation of a guard ring.

The effect of doping in the drift layer and the thickness and extent of extension beyond the cathode contact of a NiO bilayer in vertical NiO/β-Ga2O3 rectifiers is reported. Decreasing the drift layer doping from 8 × 1015 to 6.7 × 1015 cm−3 produced an increase in reverse breakdown voltage (VB) from 7.7 to 8.9 kV, the highest reported to date for small diameter devices (100 μm). Increasing the bottom NiO layer from 10 to 20 nm did not affect the forward current–voltage characteristics but did reduce reverse leakage current for wider guard rings and reduced the reverse recovery switching time. The NiO extension beyond the cathode metal to form guard rings had only a slight effect (∼5%) in reverse breakdown voltage. The use of NiO to form a pn heterojunction made a huge improvement in VB compared to conventional Schottky rectifiers, where the breakdown voltage was ∼1 kV. The on-state resistance (RON) was increased from 7.1 m Ω cm2 in Schottky rectifiers fabricated on the same wafer to 7.9 m Ω cm2 in heterojunctions. The maximum power figure of merit (VB)2/RON was 10.2 GW cm−2 for the 100 μm NiO/Ga2O3 devices. We also fabricated large area (1 mm2) devices on the same wafer, achieving VB of 4 kV and 4.1 A forward current. The figure-of-merit was 9 GW  cm−2 for these devices. These parameters are the highest reported for large area Ga2O3 rectifiers. Both the small area and large area devices have performance exceeding the unipolar power device performance of both SiC and GaN.

Vertical geometry NiO/β n-Ga2O/n+ Ga2O3 heterojunction rectifiers with contact sizes from 50 to 200 μm diameter showed breakdown voltages (VB) up to 7.5 kV for drift region carrier concentration of 8 × 1015 cm−3. This exceeds the unipolar 1D limit for SiC and was achieved without substrate thinning or annealing of the epi layer structure. The power figure-of-merit, VB2/RON, was 6.2 GW cm−2, where RON is the on-state resistance (9.3–14.7 mΩ cm2). The average electric field strength was 7.56 MV/cm, approaching the maximum for β-Ga2O3. The on–off ratio switching from 5 to 0 V was 2 × 1013, while it was 3 × 1010–2 × 1011 switching to 100 V. The turn-on voltage was in the range 1.9–2.1 V for the different contact diameters, while the reverse current density was in the range 2 × 10−8–2 × 10−9 A cm−2 at −100 V. The reverse recovery time was 21 ns, while the forward current density was &gt;100 A/cm2 at 5 V.

NiO/β-(Al xGa1− x)2O3/Ga2O3 heterojunction lateral geometry rectifiers with diameter 50–100  μm exhibited maximum reverse breakdown voltages >7 kV, showing the advantage of increasing the bandgap using the β-(Al xGa1− x)2O3 alloy. This Si-doped alloy layer was grown by metal organic chemical vapor deposition with an Al composition of ∼21%. On-state resistances were in the range of 50–2180 Ω cm2, leading to power figures-of-merit up to 0.72 MW cm−2. The forward turn-on voltage was in the range of 2.3–2.5 V, with maximum on/off ratios >700 when switching from 5 V forward to reverse biases up to −100 V. Transmission line measurements showed the specific contact resistance was 0.12 Ω cm2. The breakdown voltage is among the highest reported for any lateral geometry Ga2O3-based rectifier.