To enhance x-ray reflectivity of silicon micropore optics using dry etching of silicon (111) wafers, iridium coating is tested by use of atomic layer deposition. An iridium layer is successfully formed on sidewalls of tiny micropores with a pore width of 20 μm and depth of 300 μm. The film thickness is ∼20  nm. An enhanced x-ray reflectivity compared to that of silicon is confirmed at Ti K_α 4.51 keV, for what we believe to be the first time, with this type of optics. Some discrepancies from a theoretical reflectivity curve of iridium-coated silicon are noticed at small incident angles <1.3°. When a geometrical shadowing effect due to occultation by a ridge existing on the sidewalls is taken into account, the observed reflectivity becomes well represented by the modified theoretical curve. An estimated surface micro roughness of ∼1  nm rms is consistent with atomic force microscope measurements of the sidewalls.

Large-aperture focusing of Al K(α) 1.49 keV x-ray photons using micropore optics made from a dry-etched 4 in. (100 mm) silicon wafer is demonstrated. Sidewalls of the micropores are smoothed with high-temperature annealing to work as x-ray mirrors. The wafer is bent to a spherical shape to collect parallel x rays into a focus. Our result supports that this new type of optics allows for the manufacturing of ultralight-weight and high-performance x-ray imaging optics with large apertures at low cost.

An alternating magnetic field assisted finishing (MAF) technique has been developed to finish the 5–20 μm wide pore sidewalls of micro-pore X-ray focusing optics fabricated using micro-electro-mechanical systems (MEMS) techniques. To understand the material removal mechanism, this MAF technique is used to finish a silicon MEMS micro-pore X-ray optic that had previously undergone a hydrogen annealing treatment. Compared to the unfinished surface, distinctive surface features are observed on the finished surfaces using scanning electron microscopy, optical profilometry, and atomic force microscopy. This demonstrates the finishing characteristics and reveals the material removal mechanism on the nanometer scale. Moreover, the representative unfinished and finished micro-pore sidewall surfaces show a reduction in roughness due to finishing from 1.72 to 0.18 nm Rq.

No abstract

No abstract

No abstract

No abstract

No abstract