This paper describes the recent advances in flexible oxide thin-film transistors (TFTs), one of the rapidly emerging technologies for the next-generation display applications. First, the paper focuses on the effect of the buffer layer over the plastic substrate, which significantly influences the electrical performance and stability of oxide TFTs. Then oxide semiconductor TFTs fabricated through atomic layer deposition among the various oxide semiconductor fabrication methods were reviewed due to their potential as high-performance flexible TFTs. Finally, the mechanical fatigue behaviors of the TFTs were investigated, including the various mechanical factors, such as the bending radius, cycles, and stress directions. Structural solutions for the TFT were also introduced, such as TFT design modification and the use of the neutral plane concept, to improve the mechanical durability.

This article is a review of recent research and development advances in oxide thin film transistors (TFTs) fabricated by atomic layer deposition (ALD) processes. The ALD process is remarkable as it offers accurate control of film thickness and composition as well as the ability to achieve excellent uniformity over large areas at relatively low temperatures. Firstly, an introduction to n-type oxide TFTs is provided with a focus on the development of active-layer material combinations from binary oxide active layers, like zinc oxide and indium oxide, to ternary and quaternary oxide active layers formed by doping with elements such as gallium or tin to achieve high mobility and high device stability for TFTs. Secondly, ALD p-type channel oxide TFTs are also introduced, which are required for the realization of many types of low-power circuits, such as complementary metal oxide semiconductor devices.

Amorphous InGaZnO semiconductors have been rapidly developed as active charge-transport materials in thin film transistors (TFTs) because of their cost effectiveness, flexibility, and homogeneous characteristics for large-area applications. Recently, InZnSnO (IZTO) with superior mobility (higher than 20 cm2 V–1 s–1) has been suggested as a promising oxide semiconductor material for high-resolution, large-area displays. However, the electrical and physical characteristics of IZTO have not been fully characterized. In this study, thin IZTO films were grown using a novel atomic layer deposition (ALD) supercycle process consisting of alternating subcycles of single-oxide deposition. By varying the number of deposition subcycles, it was determined that the insertion of a Sn–O cycle improved the mobility and reliability of IZTO-based TFTs. Specifically, the IZTO TFT obtained using one In–O cycle, one Zn–O cycle, and one Sn–O exhibited the best performance (saturation mobility of 27.8 cm2 V–1 s–1 and threshold voltage shift of 1.8 V after applying positive-bias temperature stress conditions). Next, the production of rollable and flexible devices was demonstrated by fabricating ALD-processed IZTO TFTs on polymer substrates. The electrical characteristics of these TFTs were retained without drastic degradation for 240,000 bending cycles. These results indicate that the supercycle ALD technique is effective for synthesizing multicomponent oxide TFTs for electronic applications requiring high mobility and mechanical flexibility.

The current article is a review of recent progress and major trends in the field of flexible oxide thin film transistors (TFTs), fabricating with atomic layer deposition (ALD) processes. The ALD process offers accurate controlling of film thickness and composition as well as ability of achieving excellent uniformity over large areas at relatively low temperatures. First, an introduction is provided on what is the definition of ALD, the difference among other vacuum deposition techniques, and the brief key factors of ALD on flexible devices. Second, considering functional layers in flexible oxide TFT, the ALD process on polymer substrates may improve device performances such as mobility and stability, adopting as buffer layers over the polymer substrate, gate insulators, and active layers. Third, this review consists of the evaluation methods of flexible oxide TFTs under various mechanical stress conditions. The bending radius and repetition cycles are mostly considering for conventional flexible devices. It summarizes how the device has been degraded/changed under various stress types (directions). The last part of this review suggests a potential of each ALD film, including the releasing stress, the optimization of TFT structure, and the enhancement of device performance. Thus, the functional ALD layers in flexible oxide TFTs offer great possibilities regarding anti-mechanical stress films, along with flexible display and information storage application fields.