ABSTRACT3C-SiC/Si structures with Ge incorporation are elaborated by solid source molecular beam epitaxy (SSMBE). A comparison of the flatness of the SiC-surface and the interface between SiC and Si by comparing the deposition with and without Ge is made. The results are analyzed within the framework of a theoretical approach based on the theory of elasticity.
The influence of Ge on the conversion process of Si to SiC was studied by depositing Ge and C on Si(111) followed by a stepwise annealing procedure. After the annealing step, the carbon deposited on the surface was completely converted into SiC. In the case of Ge predeposition, the SiC amount detected by XPS, AES and ellipsometry was lower compared to the reference sample in which no Ge was predeposited on the Si(111) surface. Therefore, Ge lowers the probability of SiC formation in the early stages. During the conversion process, Ge diffuses into the Si substrate and is mainly located near the SiC-Si interface with a concentration of around 2.5-3%. As a result of a complex alloying process promoted by interdiffusion of C and Ge as well as SiC nucleation, a thin 3C-SiC layer is formed on top of a Si 1−x Ge x buffer layer.
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