In conventional thermal spraying, the spray particles are partially or fully molten when they deposit on the substrate. Cold spraying, in contrast, uses less thermal and more kinetic energy. In this process, solid particles impact on the substrate at high velocities and form excellent coatings. Due to comparatively low temperatures and typically inert process gases, cold spraying is particularly suitable for heat and oxidation sensitive materials. In recent years, modeling and computational methods have been widely used to study this relatively new spraying process, particularly to describe impact conditions of particles, to improve nozzle design, and to provide a better understanding of the thermo-mechanical processes that lead to particle bonding and deposition. This paper summarizes the state of the art in these theoretical studies, alongside a comprehensive description of the process. The paper also discusses the prediction of coating properties in the light of modeling combined with experimental investigations.
Cold spraying is a coating technique in which the formation of dense, tightly bonded coatings occurs only due to the kinetic energy of high velocity particles of the spray powder. These particles are still in the solid state as they impinge on the substrate. This study correlates optimized deposition parameters with the corresponding microstructure as well as mechanical and conductive behavior of cold sprayed copper coatings in order to explain possible bonding mechanisms. In addition, the performance of cold sprayed copper coatings is compared to that of cold rolled copper and to coatings prepared by thermal spray methods.
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