2009
DOI: 10.1007/s11666-009-9357-7
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From Particle Acceleration to Impact and Bonding in Cold Spraying

Abstract: In conventional thermal spraying, the spray particles are partially or fully molten when they deposit on the substrate. Cold spraying, in contrast, uses less thermal and more kinetic energy. In this process, solid particles impact on the substrate at high velocities and form excellent coatings. Due to comparatively low temperatures and typically inert process gases, cold spraying is particularly suitable for heat and oxidation sensitive materials. In recent years, modeling and computational methods have been w… Show more

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Cited by 489 publications
(221 citation statements)
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“…In the impact of spherical objects -be it a 20-mm ball or a 20-µm particle -such a condition exists at the centre of the contact zone, where the interacting surfaces are almost parallel. It should be noted that bonding may also occur at the central zone due to frictional dissipation in angular impact [70], but this is not a common feature in CS. Figure 17.…”
Section: Bonding Of Single Microparticlesmentioning
confidence: 99%
See 1 more Smart Citation
“…In the impact of spherical objects -be it a 20-mm ball or a 20-µm particle -such a condition exists at the centre of the contact zone, where the interacting surfaces are almost parallel. It should be noted that bonding may also occur at the central zone due to frictional dissipation in angular impact [70], but this is not a common feature in CS. Figure 17.…”
Section: Bonding Of Single Microparticlesmentioning
confidence: 99%
“…The table excludes the work on metallic glasses, which are discussed separately below. [24,70,107,[183][184][185] Early studies, reference material Nanocrystals Electrodes…”
Section: Metallic Materialsmentioning
confidence: 99%
“…It is well known that material deposition in cold spray results from high-velocity impact and subsequent deformation of particles (Ref [2][3][4][5][6][7][8][9]. The resulting adiabatic shear instabilities provide sufficient material flow and heat for bonding at the interface between particle and substrate.…”
Section: Introductionmentioning
confidence: 99%
“…The present analysis moves forward by considering the effect of various factors on v cr . Moreover, the seemingly complicated effect of process conditions on final properties of the deposit is reduced into simple relationships in view of the existing experimental data (Ref 8,9,19,(22)(23)(24)(25). To facilitate the analysis, v pi and v cr are expressed explicitly in terms of primary key parameters, namely, the particle size and the process gas pressure and temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Since the impact process takes place in a short period of time, heat cannot distribute equally throughout the particle and the substrate, resulting in localized heating. Consequently, this localized heating causes temperature rises at the interface of the particle/substrate or particle/particle [42]. From Figure 2.10 it can be seen that for impact velocities greater than 400 m/s a sudden jump in the interface temperature takes place.…”
Section: Particle Deformation and Bonding Mechanismmentioning
confidence: 98%