In this work, we demonstrate that both capacitance and inductance must be the central parameters associated with the Charged Device Model (CDM) waveform verification modules. We also propose a change from the previously used FR-4 dielectric material substrate to a more stable Alumina. This improves waveform repeatability and will lead to better correlation of test results. This paper completes the groundwork for a full ESDA CDM device testing standard.
Six different CMOS device codes were evaluated, according to available test standards, for Electrostatic Discharge (ESD) sensitivity using three ESD models:Body Model (HBM) Q Machine Model (MM) Field-Induced Charged Device Model (FCDM)Four commercially available simulators were used: two to perform the HBM ESD evaluations and two to perform the MM ESD evaluations. FCDM stressing was performed using an AT&T designed simulator. All stressing was performed at AT&T Bell Laboratories, Delco Electronics, and Ford Microelectronics. The failure threshold voltage and failure signature associated with each ESD model and simulator were determined for each test sample. Threshold correlation and regression analyses were also performed.Though the three ESD models and simulators created multiple failure signatures, they do not exhibit a high degree of overlap. Our results will show a high correlation between the ESD thresholds, failing pins, failing circuitry, and failing structures for HBM and MM stressing of the device codes evaluated. 4.2.2EOS/ESD SYMPOSIUM 95-176
This paper will focus on a new resin technology that improves proppant flowback control under extreme conditions. The combination of dual phase flow and pressure drops in high rate gas wells has made proppant flowback a significant problem. These conditions must be addressed to maximize well productivity and minimize production costs. Moreover, the problems associated with cyclic stress effects can further hamper well production and tax any technology controlling proppant flowback. The most commonly applied proppant flowback control technology is the use of curable resin coated proppant (CRCP) either entirely or as a tail-in for hydraulic fracturing treatments. CRCPs have an established history in the consolidation of proppant packs under defined conditions of time, temperature, and closure stress. Improvements in CRCP performance have been facilitated by use of a new resin system through chemical and process changes. These changes have enhanced resin bond strength (RBS) characteristics commonly measured as unconfined compressive strength (UCS). Data shows RBS is anything but the dominant trait in preventing proppant flowback. This is most evident when the proppant pack is subjected to a large pressure drop, Non-Darcy multi-phase flow, temperature, and cyclic stress. Further associated effects are prolonged pumping time and elevated temperature exposure during CRCP placement. The CRCP placed under these conditions is subjected to elevated temperatures while the proppant is transported into the fracture and before fracture closure. CRCP performance testing in the laboratory can accurately depict these effects. A new resin technology is presented that is specifically designed to withstand the aforementioned conditions. The performance benefits are documented by rigorous laboratory testing (under simulated downhole conditions) and case history data from stimulation treatments performed on deep, high flow rate gas wells. Introduction Numerous references to the need for proppant flowback control in high rate wells and the consequences of proppant back production have been published.1–4,8 Loss of fracture connectivity to the wellbore and the resultant loss of productivity, potential damage to surface production equipment and the related safety issues, plus the waste of time and resources make proppant flowback control critical in maximizing the NPV of a well. The demand for reserves from deep, lower permeability, high temperature reservoirs in South Texas and the Gulf of Mexico5 has dictated that sophisticated proppant stimulation is required to achieve economic production levels. Bottom hole static temperatures (BHST) for producing formations in South Texas can average between 149°C and 232°C. Wells in the 166°C BHST range are now quite common. CRCPs have had great success in HT/HP applications where the proppant placement and fracture closure times were modest. In other work, Underdown13 taught that modified phenolic resin coatings are stable to at least 300°C. As cost-effective deep, slim hole and tubingless completions in South Texas and the Gulf of Mexico have become more common, the slurry pumping rates that proppant can be placed have been greatly reduced. Combined with the longer fracture lengths and associated fluid/proppant volumes that are required, the total job pump times can run several hours. Additionally, due to the lower permeability of the formations, fracture closure on the proppant due to fluid leak off may take hours instead of minutes.
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