We report the achievement of highly efficient 10 B enriched hexagonal boron nitride (h-10 BN) direct conversion neutron detectors. These detectors were realized from freestanding 4-in. diameter h-10 BN wafers 43 lm in thickness obtained from epitaxy growth and subsequent mechanical separation from sapphire substrates. Both sides of the film were subjected to ohmic contact deposition to form a simple vertical "photoconductor-type" detector. Transport measurements revealed excellent vertical transport properties including high electrical resistivity (>10 13 X cm) and mobilitylifetime (ls) products. A much larger ls product for holes compared to that of electrons along the c-axis of h-BN was observed, implying that holes (electrons) behave like majority (minority) carriers in undoped h-BN. Exposure to thermal neutrons from a californium-252 (252 Cf) source moderated by a high density polyethylene moderator reveals that 43 lm h-10 BN detectors possess 51.4% detection efficiency at a bias voltage of 400 V, which is the highest reported efficiency for any semiconductor-based neutron detector. The results point to the possibility of obtaining highly efficient, compact solid-state neutron detectors with high gamma rejection and low manufacturing and maintenance costs.

Solid-state thermal neutron detectors with improved detection efficiencies are highly sought after for many applications. Hexagonal boron nitride (hBN) epilayers have been synthesized by metal organic chemical vapor deposition on sapphire substrates. Important material parameters including the mobility-lifetime (μτ) product and the thermal neutron absorption length (λ) have been measured. For hBN epilayers with a room temperature resistivity of 5.3 Â 10 10 Ω cm, the measured μτ product of electrons is 4.46 Â 10 À 8 cm 2 /V and of holes is 7.07 Â 10 À 9 cm 2 /V. The measured λ values are 277 μm and 77 μm for natural and 10 B enriched hBN epilayers, respectively. Metal-semiconductor-metal detectors incorporating 0.3 mm thick hBN epilayers were fabricated. The reaction product pulse-height spectra were measured under thermal neutron irradiation produced by a 252 Cf source moderated by high density polyethylene block. The measured pulse-height spectra revealed distinguishable peaks corresponding to the product energies of 10 B and neutron reaction with the 0.84 MeV 7 Li peak being the most prominent. The detectors exhibited negligible responses to gamma rays produced by 137 Cs decay. Our results indicate that hBN epilayers are highly promising for realizing highly sensitive solid-state thermal neutron detectors with expected advantages resulting from semiconductor technologies, including compact size, light weight, ability to integrate with other functional devices, and low cost.

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The suitability of Si as an n-type dopant in hexagonal boron nitride (hBN) wide bandgap semiconductor has been investigated. Si doped hBN epilayers were grown via in-situ Si doping by metal organic chemical vapor deposition technique. Hall effect measurements revealed that Si doped hBN epilayers exhibit n-type conduction at high temperatures (T > 800 K) with an in-plane resistivity of ∼12 Ω·cm, electron mobility of μ ∼ 48 cm2/V·s and concentration of n ∼ 1 × 1016 cm−3. Temperature dependent resistivity results yielded a Si energy level in hBN of about 1.2 eV, which is consistent with a previously calculated value for Si substitutionally incorporated into the B sites in hBN. The results therefore indicate that Si is not a suitable dopant for hBN for room temperature device applications.

Solid-state neutron detectors with high performance are highly sought after for the detection of fissile materials. However, direct-conversion neutron detectors based on semiconductors with a measureable efficiency have not been realized. We report here the first successful demonstration of a direct-conversion semiconductor neutron detector with an overall detection efficiency for thermal neutrons of 4% and a charge collection efficiency as high as 83%. The detector is based on a 2.7 μm thick 10B-enriched hexagonal boron nitride (h-BN) epitaxial layer. The results represent a significant step towards the realization of practical neutron detectors based on h-BN epilayers. Neutron detectors based on h-BN are expected to possess all the advantages of semiconductor devices including wafer-scale processing, compact size, light weight, and ability to integrate with other functional devices.