A novel laser-assisted particle removal (LAPR) technique capable of removing micron scale particles from semiconductor substrates is presented. In our preliminary experiments the contaminated substrates were dosed with water which preferentially adsorbs in the capillary spaces under and around the particles and were subsequently irradiated with transverse, electric, atomspheric CO2 laser pulses. At the CO2 laser wavelength the beam energy is mainly absorbed in the water and not the substrate. The subsequent explosive evaporation of the adsorbed water molecules produces forces many orders of magnitude larger than the adhesion forces between the particle and the substrate which propel the particles off the substrate surface. LAPR is inherently clean and can easily be incorporated into current or planned wafer processing systems.

The dynamics of explosive boiling of a 2-propanol layer of variable thickness on a Si substrate heated by a nanosecond KrF excimer laser was studied using a contact photoacoustic technique. The transition from acoustic generation at a free Si boundary to that at a rigid alcohol/Si boundary accompanied by a sharp increase of acoustic generation efficiency was found above a laser fluence threshold of 0.17 J/cm2 and a liquid layer thickness greater than 0.25 μm due to subnanosecond near-critical explosive boiling of the superheated liquid layer near the hot absorbing Si substrate. The gradual increase of the photoacoustic response of the superheated alcohol with increasing thickness of the liquid film at fluences above the explosive boiling threshold was attributed to a diffraction effect due to the fluence- and time-dependent increase of the area undergoing explosive boiling. A model describing photoacoustic generation and subsequent lift-off of the entire liquid layer in this experimental “thin transparent liquid layer/solid absorbing substrate” geometry under near-critical explosive boiling conditions has been proposed.

For the first time to the best of our knowledge, a simultaneous 10.6 mum CO(2) laser pulse has been used to enhance the Laser Induced Breakdown Spectroscopy (LIBS) emission from a 1.064 mum Nd:YAG laser induced plasma on a hard target. The enhancement factor was on the order of 25 to 300 times, depending upon the emission lines observed. For an alumina ceramic substrate the Al emission lines at 308 nm and Fe impurity line at 278 nm showed an increase of 60x and 119x, respectively. The output energy of the Nd:YAG laser was 50 mJ/pulse focused to a 1 mm diameter spot to produce breakdown. The CO(2) laser pulse had a similar energy density of 40 mJ/mm(2). Timing overlap of the two laser pulses within 1 microsecond was important for enhancement to be observed. An observed feature was the differential enhancement between different elemental species and also between different ionization states, which may be helpful in the application of LIBS for multi-element analysis.

Water plume velocities were measured in air by optical transmission as a function of laser fluence using a KrF laser for explosive boiling and liftoff of a layer of micron-scale water droplets from a laser-heated Si substrate of interest for laser particle removal. The thickness of the superheated water layer near the water/Si interface determines acceleration and removal of the water droplets from the Si substrate.

A mechanism of ultradeep (up to tens of microns per pulse, submillimeter total hole depths) plasma-assisted ablative drilling of optically opaque and transparent materials by high-power nanosecond lasers has been proposed and verified experimentally using optical transmission and contact photoacoustic techniques to measure average drilling rates per laser shot versus laser intensity at constant focusing conditions. The plots of average drilling rates versus laser intensity exhibit slopes which are in good agreement with those predicted by the proposed model and also with other experimental studies. The proposed ultradeep drilling mechanism consists of a number of stages, including ultradeep “nonthermal” energy delivery into bulk solids by the short-wavelength radiation of the hot ablative plasma, bulk heating and melting, accompanied by subsurface boiling in the melt pool, and resulting melt expulsion from the target.