On annealing a boron implanted Si sample at ∼800 °C, boron in the tail of the implanted profile diffuses very fast, faster than the normal thermal diffusion by a factor 100 or more. After annealing for a sufficiently long time, the enhanced diffusion saturates. The enhanced diffusion is temporary, on annealing the sample a second time after saturation, enhanced diffusion does not occur. It is therefore designated as transient enhanced diffusion (TED). The high concentration peak of the implanted boron profile, which is electrically inactive, does not diffuse. TED makes it difficult to fabricate modern Si based devices, in particular TED produces the parasitic barriers which degrade the performance of the SiGe heterostructure bipolar transistors and TED can limit the fabrication of shallow junctions required for sub-100 nm complementary metal–oxide–semiconductor technology. The mechanisms of TED have been elucidated recently. A Si interstitial “kicks out” the substitutional boron atom to an interstitial position where it can diffuse easily. Alternatively the interstitials and boron atoms form highly mobile pairs. In both cases Si interstitials are required for the diffusion of boron. Therefore the enhanced boron diffusivity is proportional to the concentration of the excess Si interstitials. The interstitials are injected during implantation with Si or dopant ions. The interstitials are also injected during oxidation of the Si surface. Therefore the diffusivity increases temporarily in both cases. Even at relatively low annealing temperatures (∼800 °C) the mobility of the interstitials is high. The TED at this temperature lasts for more than 1 h. This large TED time can be explained by the presence of interstitial clusters and interstitial–boron clusters. The interstitial clusters are the {311} extended defects and dislocation loops. The precise structure of interstitial–boron clusters is not yet known though several models have been proposed. The clusters are the reservoirs of the interstitials. When the supersaturation of interstitials becomes low, the clusters dissolve and emit interstitials. The interstitials emitted from the clusters sustain the TED. Many groups have suggested that the rate of emission of interstitials is determined by Ostwald ripening of the clusters. However, recently TED evolution has also been explained without invoking Ostwald ripening of the {311} defects. The evidence of Ostwald ripening of dislocation loops is more direct. In this case the Ostwald ripening has been confirmed by the measurements of the size distributions of the dislocation loops at different times and temperatures of annealing. At higher temperatures the extended clusters are not stable and coupling between the interstitials and boron atoms is reduced. Therefore at high temperatures TED lasts only for a short time. At high temperatures the displacement during TED is also small. This suggests that if rapid thermal annealing with high ramp rates is used, TED should be suppressed. Currently high ramp rates, 300–400 °C/s are being tried to suppress TED.

As semiconductor device dimensions continue to decrease, the main challenge in the area of junction formation involves decreasing the junction depth while simultaneously decreasing the sheet resistance. Laser annealing is being investigated as an alternative to rapid thermal annealing to repair the damage from ion implantation and to activate the dopants. With this technique, uniform, box-shaped profiles are obtained, with dopant concentrations that can exceed equilibrium solubility limits at normal processing temperatures. Unfortunately, these super-saturated dopant concentrations exist in a metastable state and deactivate upon further thermal processing. In this article, we describe a comprehensive study of the deactivation kinetics of common dopants (P, B, and Sb) across a range of concentrations and annealing conditions. For comparison, As deactivation data from the literature is also presented. P and As deactivate substantially at temperatures as low as 500 °C, while Sb at moderate concentrations and B remain fully active until 700 to 800 °C. It is proposed that As and P deactivate through the formation of small dopant-defect clusters while B deactivates through precipitation. The proximity to the surface is shown to be a second-order effect.

Extensive work has been done on the SiGe HBTs for BiCMOS applications recently. The work on stability, reliability, simulation and material parameters is critically examined and reviewed in this part of the review. The work on the design, technology and performance of the HBTs will be discussed in part II of the review.

There has been considerable interest recently, in the formation of the source drain junctions of metal oxide semiconductor transistors using solid phase epitaxy (SPE) to activate the dopants rather than a traditional high temperature anneal. Previous studies have shown that this method results in high dopant activation as well as shallow junctions (due to the small thermal budget). In this we study the effect the temperature of SPE regrowth has on the boron activation. We find that boron activation has a monotonically increasing dependence on the temperature. Significantly, we show that by carrying out the SPE regrowth at temperatures above 1050°C, it is possible to obtain active concentrations well above the electrical solubility limits.

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