CMOS technology is one of the most frequently used technologies in the semiconductor industry as it can be successfully integrated with ICs. Every two years the number of MOS transistors doubles because the size of the MOSFET is reduced. Reducing the size of the MOSFET reduces the size of the channel length which causes short channel effects and it increases the leakage current. To reduce the short channel effects new designs and technologies are implemented. Double gate MOSFET design has shown improvement in performance as amplifiers over a single MOSFET. Silicon-based MOSFET design can be used in a harsh environment. It has been used in various applications such as in detecting biomolecules. The increase in number of gates increases the current drive capability of transistors. GAA MOSFET is an example of a quadruple gate around the four sides of channel that increases gate control over the channel region. It also increases effective channel width that improves drain current and reduces leakage current keeping short channel effects under limit. Junctionless MOSFET operates faster and uses less power with increase in ON-state current leading to a good value of I
ON/I
OFF ratio. In this paper, several gate and channel engineered MOSFET structures are analyzed and compared for sub 45 nm technology node. A comparison among different MOSFET structures has been made for subthreshold performance parameters in terms of I
OFF, subthreshold slope and DIBL values. The analog/RF performance is analyzed for transconductance, effective transistor capacitances, stability factor and critical frequency. The paper also covers different applications of advance MOSFET structures in analog/digital or IoT/ biomedical applications.
In this paper, the strategic review of different materials that are used in FinFET structure is studied. This is achieved by using carefully designed source/drain spacers and doped extensions to mitigate the off-current, typically high in narrow band-gap materials, as part of a CMOS compatible replacement-metal gate process flow. FinFETs are promising substitutes for bulk complementary metal oxide semiconductor. FinFETs are dual-gate devices and Good electrostatic characteristics which are obtained in a wide range of device dimensions. The simulations provide further insights into device functionality and about the dominant off-state leakage mechanisms. The GaAs material was examined by scanning transmission electron microscopy (STEM) and the epitaxial structures showed good crystal quality. In this various types of materials are used and studied they are FinFET based Dual KK-structure, InGaAs-on-Insulator FinFET, Double Gate based n-FinFET using Hafnium oxide, SOI-FinFETs, MosFET (Multi gate), Deeply Scaled CMOS, FinFET, Selective Epitaxial Si Growth in FinFET and Atomic Layer Deposition (ALD) in FinFET. Furthermore, we demonstrate a controlled GaAs digital etching process to create doped extensions below the source-drain spacer regions.
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