We use the combinatorial sputter technique to simultaneously sputter HfO2 and Al2O3 targets to obtain a film of HfxAl1-xOy of specific compositions. The effect of oxide thickness, oxide composition (i.e. Hf:Al ratio) and oxygen gettering layer thickness on DC sweep based resistive switching performance of RRAM is investigated. The oxide thickness primarily affects forming voltage and causes the memory window to increase for the thinnest oxide (6 nm, other thicknesses – 12 nm, 18 nm). The composition of oxide has a non-linear effect on the memory window (high to low resistance ratio) and variability of resistance states whereas the variability of set voltage improves significantly for ternary oxide compared to individual binary oxides. Finally, electrode interlayer for oxygen-gettering is also critical where a thin Ti layer of 1.5nm maintains the memory window but reduces variability in HRS, LRS, reduces Vset and Vreset and improves the variability in Vset.

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Next generation networks for handling OC-192 POS and 10 GbE traffic are employing new physical layer devices based on the OIF SPI-4.2 interface standard. This has created a migration issue for the network equipment provider needing to incorporate the newer SPI-4.2 technology into an existing platform currently operating under an earlier standard, such as the NPF CSIX-L1 which was commonly used for OC-48/ 2.5 Gbps applications. We describe, here, a "tunneling" strategy to achieve protocol interoperability, in which special tagging information is inserted into the packet flows through the CSIX-L1 interface to align with the SPI-4.2 data structure. The tunneling strategy has been applied to a common switch fabric prototype system. Performance measurements have been made and are presented showing the capability that such an interoperable packet switching system can achieve.Standards-based switch fabric devices have been replacing proprietary ASICs and older switch technology to provide high quality of service (QoS) non-blocked switching in the latest platforms being developed for converged network applications. Deployed as chip sets, these devices began use in switching and routing applications of OC-48 / 2.5 Gbps line rate devices and have now migrated to service OC-192 /10 GbE ports. In this migration the specification for the fabric interface has moved from the NPF CSIX-L1 standard, to the OIF SPI-4.2 standard for supporting 10 Gbps physical devices.