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This paper presents an efficient analytical solution strategy to determine the adhesive stresses in balanced and unbalanced adhesively bonded joints with mixed force loading and/or displacement boundary conditions. The adhesive stresses are expressed in terms of geometrical dimensions and material properties, combined with integration constants obtained numerically. The model is successfully applied for the analysis of various types of joints, including balanced and unbalanced stiffened plate/joint, single-strap joint, and single-lap joint. In all such cases, the linear equation sets are supplied to determine the integration constants in the final stress expressions. The analytical predictions agree well with the finite element results for adhesive stresses. This proposed model can be extended conveniently to predict the mechanical behavior of similar bonded structures such as composite laminates, electronics packaging, and flexible electronics structures

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The paper presents a mechanical model of the mixed-mode bending (MMB) test used to assess the mixed-mode interlaminar fracture toughness of composite laminates. The laminated specimen is considered as an assemblage of two sublaminates partly connected by an elasticbrittle interface. The problem is formulated through a set of 36 differential equations, accompanied by suitable boundary conditions. Solution of the problem is achieved by separately considering the two subproblems related to the symmetric and antisymmetric parts of the loads, which for symmetric specimens correspond to fracture modes I and II, respectively. Explicit expressions are determined for the interfacial stresses, internal forces, and displacements.