The field of optical lithography is subject to intense research and has gained enormous improvement. However, the effort necessary for creating structures at the size of 20 nm and below is considerable using conventional technologies. This effort and the resulting financial requirements can only be tackled by few global companies and thus a paradigm change for the semiconductor industry is conceivable: custom design and solutions for specific applications will dominate future development (Fritze in: Panning EM, Liddle JA (eds) Novel patterning technologies. International society for optics and photonics. SPIE, Bellingham, 2021. 10.1117/12.2593229). For this reason, new aspects arise for future lithography, which is why enormous effort has been directed to the development of alternative fabrication technologies. Yet, the technologies emerging from this process, which are promising for coping with the current resolution and accuracy challenges, are only demonstrated as a proof-of-concept on a lab scale of several square micrometers. Such scale is not adequate for the requirements of modern lithography; therefore, there is the need for new and alternative cross-scale solutions to further advance the possibilities of unconventional nanotechnologies. Similar challenges arise because of the technical progress in various other fields, realizing new and unique functionalities based on nanoscale effects, e.g., in nanophotonics, quantum computing, energy harvesting, and life sciences. Experimental platforms for basic research in the field of scale-spanning nanomeasuring and nanofabrication are necessary for these tasks, which are available at the Technische Universität Ilmenau in the form of nanopositioning and nanomeasuring (NPM) machines. With this equipment, the limits of technical structurability are explored for high-performance tip-based and laser-based processes for enabling real 3D nanofabrication with the highest precision in an adequate working range of several thousand cubic millimeters.

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We provide a review of the latest research findings as well as the future potential of plasma-based etching technology for the fabrication of micro-optical components and systems. Reactive ion etching (RIE) in combination with lithographic patterning is a well-established technology in the field of micro-and nanofabrication. Nevertheless, practical implementation, especially for plasma-based patterning of complex optical materials such as alumino-silicate glasses or glass-ceramics, is still largely based on technological experience rather than established models. Such models require an in-depth understanding of the underlying chemical and physical processes within the plasma and at the glass-plasma/mask-plasma interfaces. We therefore present results that should pave the way for a better understanding of processes and thus for the extension of RIE processes toward innovative three-dimensional (3D) patterning as well as for the processing of chemically and structurally inhomogeneous silicate-based substrates. To this end, we present and discuss the results of a variety of microstructuring strategies for different application areas with a focus on micro-optics. We consider the requirements for refractive and diffractive micro-optical systems and highlight potentials for 3D dry chemical etching by selective tailoring of the material structure. The results thus provide first steps toward a knowledge-based approach to RIE processing of universal dielectric glass materials for optical microsystems, which also has a significant impact on other microscale applications. © The Authors. Published by SPIE under a Creative Commons Attribution 4.0 International License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

It is well known that tunable lenses, with refractive power that can be varied, e.g., by changing the curvature of a membrane, can replace the motion of lens groups in zoom systems. Similar to classical zoom systems, the performance of these systems is heavily influenced by the fundamental first-order layout. Moreover, the first-order layout sets the most important requirements for the employed tunable lenses. In this contribution, we present a method for the analysis of a large number of possible first-order solutions for typical requirements and for the selection of the most promising layouts. The first-order solution space is mapped, allowing the layouts to be automatically filtered and plotted depending on pre-defined characteristics. Ray tracing of the marginal and chief rays combined with the traditional thin lens aberration theory provide efficient estimations of the expected installation space requirements and performance for each firstorder layout. Using an example, we demonstrate good agreement between these estimations and the corresponding real lens layout, optimized by commercial raytracing software. The presented design method for zoom systems based on tunable lenses is compared with similar approaches for classical zoom lenses.

We present an architectural approach to overcome the interconnection problem of modern VLSI-circuits and demonstrate it experimentally in form of a multi-chip-module (MCM) in which four optoelectronic VLSI-chips communicate optically via a planar-integrated free-space optical system. The MCM implements a distributed parallel computing model and is compact and robust. The optical system has been integrated on the surfaces of a slab of quartz glass by means of lithographic microfabrication techniques. The quartz substrate also serves as circuit board for the opto-electronic VLSI-chips. Our approach allows dense packaging (>100 per mm2) of large numbers of optical interconnects.