This paper presents the correlation between electrical and reliability properties and processing conditions. Fodel® photoimageable technology as an extension of traditional thick-film process providing a higher line resolution, has been considered in the field of unconventional application based on both 3D bent multilayers and thick film mono and multilayer inductors construction with a resolution about 150 µm. Common denominator of two different ideas is our experience with thick film photoimageable conductors and study of chosen electrical and reliability properties. The developed and adapted LTCC technology based on photoimageable technology has produced about 100 µm wide lines that are composed in shaped 3D bent multilayer structures. Chosen electrical properties of inductors based on photoimageable conductor has been evaluated including their ageing reliability test.
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