Integration of graphene field-effect transistors (GFETs) requires the ability to grow or deposit high-quality, ultrathin dielectric insulators on graphene to modulate the channel potential. Here, we study a novel and facile approach based on atomic layer deposition through ozone functionalization to deposit high-κ dielectrics (such as Al(2)O(3)) without breaking vacuum. The underlying mechanisms of functionalization have been studied theoretically using ab initio calculations and experimentally using in situ monitoring of transport properties. It is found that ozone molecules are physisorbed on the surface of graphene, which act as nucleation sites for dielectric deposition. The physisorbed ozone molecules eventually react with the metal precursor, trimethylaluminum to form Al(2)O(3). Additionally, we successfully demonstrate the performance of dual-gated GFETs with Al(2)O(3) of sub-5 nm physical thickness as a gate dielectric. Back-gated GFETs with mobilities of ~19,000 cm(2)/(V·s) are also achieved after Al(2)O(3) deposition. These results indicate that ozone functionalization is a promising pathway to achieve scaled gate dielectrics on graphene without leaving a residual nucleation layer.

During chemical-vapor-deposited graphene transfer onto target substrates, a polymer film coating is necessary to provide a mechanical support. However, the remaining polymer residues after organic solvent rinsing cannot be effectively removed by the empirical thermal annealing in vacuum or forming gas. Little progress has been achieved in the past years, for little is known about the chemical evolution of the polymer macromolecules and their interaction with the environment. Through in situ Raman and infrared spectroscopy studies of PMMA transferred graphene annealed in nitrogen, two main processes are uncovered involving the polymer dehydrogenation below 200 °C and a subsequent depolymerization above 200 °C. Polymeric carbons over the monolayer graphitic carbon are found to constitute a fundamental bottleneck for a thorough etching of PMMA residues. The dehydrogenated polymeric chains consist of active CC bonding sites that are readily attacked by oxidative gases. The combination of Raman spectroscopy, X-ray photoemission spectroscopy, and transmission electron microscopy reveals the largely improved carbon removal by annealing in oxidative atmospheres. CO2 outperforms other oxidative gases (e.g., NO2, O2) because of its moderate oxidative strength to remove polymeric carbons efficiently at 500 °C in a few minutes while preserving the underlying graphene lattice. The strategy and mechanism described here open the way for a significantly improved oxidative cleaning of transferred graphene sheets, which may require optimization tailored to specific applications.

Despite the number of existing studies that showcase the promising application of fluorinated graphene in nanoelectronics, the impact of the fluorine bonding nature on the relevant electrical behaviors of graphene devices, especially at low fluorine content, remains to be experimentally explored. Using CF4 as the fluorinating agent, we studied the gradual structural evolution of chemical vapor deposition graphene fluorinated by CF4 plasma at a working pressure of 700 mTorr using Raman and X-ray photoelectron spectroscopy (XPS). After 10 s of fluorination, our XPS analysis revealed a co-presence of covalently and ionically bonded fluorine components; the latter has been determined being a dominant contribution to the observation of two Dirac points in the relevant electrical measurement using graphene field effect transistor devices. Additionally, this ionic C-F component (ionic bonding characteristic charge sharing) is found to be present only at low fluorine content; continuous fluorination led to a complete transition to a covalently bonded C-F structure and a dramatic increase of graphene sheet resistance. Owing to the formation of these various C-F bonding components, our temperature-dependent Raman mapping studies show an inhomogeneous defluorination from annealing temperatures starting at ∼150 °C for low fluorine coverage, whereas fully fluorinated graphene is thermally stable up to ∼300 °C.

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