Deuterium (hydrogen) incorporation in dilute nitrides (e.g., GaAsN and GaPN) modifies dramatically the crystal's electronic and structural properties and represents a prominent example of defect engineering in semiconductors. However, the microscopic origin of D-related effects is still an experimentally unresolved issue. In this paper, we used nuclear reaction analyses and/or channeling, high resolution x-ray diffraction, photoluminescence, and x-ray absorption fine structure measurements to determine how the stoichiometric [D]/[N] ratio and the local structure of the N-D complexes parallel the evolution of the GaAsN electronic and strain properties upon irradiation and controlled removal of D. The experimental results provide the following picture: (i) Upon deuteration, nitrogen-deuterium complexes form with [D]/[N]=3, leading to a neutralization of the N electronic effects in GaAs and to a strain reversal (from tensile to compressive) of the N-containing layer. (ii) A moderate annealing at 250 degrees C gives [D]/[N]=2 and removes the compressive strain, therefore the lattice parameter approaches that of the N-free alloy, whereas the N-induced electronic properties are still passivated. (iii) Finally, annealings at higher temperature (330 degrees C) dissolve the deuterium-nitrogen complexes, and consequently the electronic properties and the tensile strain of the as-grown GaAsN lattice are recovered. Therefore, we conclude that the complex responsible for N passivation contains two deuterium atoms per nitrogen atom, while strain reversal in deuterated GaAsN is due to a complex with a third, less tightly bound deuterium atom

Large-scale integration of MoS2 in electronic devices requires the development of reliable and cost-effective deposition processes, leading to uniform MoS2 layers on a wafer scale. Here we report on the detailed study of the heterogeneous vapor-solid reaction between a pre-deposited molybdenum solid film and sulfur vapor, thus resulting in a controlled growth of MoS2 films onto SiO2/Si substrates with a tunable thickness and cm(2)-scale uniformity. Based on Raman spectroscopy and photoluminescence, we show that the degree of crystallinity in the MoS2 layers is dictated by the deposition temperature and thickness. In particular, the MoS2 structural disorder observed at low temperature (<750 °C) and low thickness (two layers) evolves to a more ordered crystalline structure at high temperature (1000 °C) and high thickness (four layers). From an atomic force microscopy investigation prior to and after sulfurization, this parametrical dependence is associated with the inherent granularity of the MoS2 nanosheet that is inherited by the pristine morphology of the pre-deposited Mo film. This work paves the way to a closer control of the synthesis of wafer-scale and atomically thin MoS2, potentially extendable to other transition metal dichalcogenides and hence targeting massive and high-volume production for electronic device manufacturing.

The growth of atomically thin MoS2 films is achieved by sulfurization of molybdenum oxide precursor films grown by atomic layer deposition. The quality features of the MoS2 films are engineered controlling the stoichiometry, morphology, and thickness of the precursors. The interface interaction between the precursor films and the substrates (SiO2 or sapphire) plays a key role in the MoS2 formation.

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Thin films of cerium dioxide (CeO2) were deposited by atomic layer deposition (ALD) at 250 °C on both Si and TiN substrates. The ALD growth produces CeO2 films with polycrystalline cubic phase on both substrates. However, the films show a preferential orientation along <200> crystallographic direction for CeO2/Si or <111> for CeO2/TiN, as revealed by X-ray diffraction.Additionally, CeO2 films differ in interface roughness depending on the substrate.