Grippers are widely used for the gripping, manipulation, and assembly of objects with a wide range of scales, shapes, and quantities in research, industry, and our daily lives. A simple yet universal solution is very challenging. Here, we manage to address this challenge utilizing a simple shape memory polymer (SMP) block. The embedding of objects into the SMP enables the gripping while the shape recovery upon stimulation facilitates the releasing. Systematic studies show that friction, suction, and interlocking effects dominate the grip force individually or collectively. This universal SMP gripper design provides a versatile solution to grip and manipulate multiscaled (from centimeter scale down to 10-μm scale) 3D objects with arbitrary shapes, in individual, deterministic, or massive, selective ways. These extraordinary capabilities are demonstrated by the gripping and manipulation of macroscaled objects, mesoscaled steel sphere arrays and microparticles, and the selective and patterned transfer printing of micro light-emitting diodes.

Transfer printing that enables heterogeneous integration of materials in desired layouts offers unprecedented opportunities for developing high-performance unconventional electronic systems. However, large-area integration of ultrathin and delicate functional micro-objects with high yields in a programmable fashion still remains as a great challenge. Here, we present a simple, cost-effective, yet robust transfer printing technique via a shape-conformal stamp with actively actuated surface microstructures for programmable and scalable transfer printing with high reliability and efficiency. The shape-conformal stamp features the polymeric backing and commercially available adhesive layer with embedded expandable microspheres. Upon external thermal stimuli, the embedded microspheres expand to form surface microstructures and yield weak adhesion for reliable release. Systematic experimental and computational studies reveal the fundamental aspects of the extraordinary adhesion switchability of stamp. Demonstrations of this protocol in deterministic assemblies of diverse challenging inorganic micro-objects illustrate its extraordinary capabilities in transfer printing for developing high-performance flexible inorganic electronics.