2020
DOI: 10.1126/sciadv.abb2393
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Programmable and scalable transfer printing with high reliability and efficiency for flexible inorganic electronics

Abstract: Transfer printing that enables heterogeneous integration of materials in desired layouts offers unprecedented opportunities for developing high-performance unconventional electronic systems. However, large-area integration of ultrathin and delicate functional micro-objects with high yields in a programmable fashion still remains as a great challenge. Here, we present a simple, cost-effective, yet robust transfer printing technique via a shape-conformal stamp with actively actuated surface microstructures for p… Show more

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Cited by 92 publications
(70 citation statements)
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“…This overcomes the issues of nanomaterials' patterning limited in 2D planes. [30][31][32] Another challenge is to simultaneously achieve both a nonadhesive elastomeric surface and electrical conductivity to the liquid metal.…”
Section: Introductionmentioning
confidence: 99%
“…This overcomes the issues of nanomaterials' patterning limited in 2D planes. [30][31][32] Another challenge is to simultaneously achieve both a nonadhesive elastomeric surface and electrical conductivity to the liquid metal.…”
Section: Introductionmentioning
confidence: 99%
“…[ 22 ] However, the scaling of the vacuum system down for chips with a lateral dimension smaller than 80 ”m and a thickness thinner than 50 ”m still remains a great challenge. [ 23 ] Advanced transfer printing techniques based on tunable adhesives regulated by controlling viscoelasticity, [ 27–31 ] surface microstructures, [ 32–35 ] and surface topography [ 36,37 ] have been developed for deterministic assembly of ultrathin micro‐devices. These tunable adhesives are very promising despite the limited strong/weak adhesion strength ratio (i.e., adhesion switchability) or weak pick‐up adhesion, which greatly limit their broad utilities.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, several in situ studies have been presented, revealing the load‐displacement responses of five table‐shaped 3D polymer mesostructures. [ 66,67 ] However, other commonly used material systems (e.g., metal and metal/polymer laminates [ 34,44,68 ] ) in 3D flexible electronics were not discussed in these works, [ 66,67 ] and no design principles or failure criteria have been proposed. Therefore, a systematic design strategy based on the comprehensive understanding of underlying failure mechanisms is highly desirable for 3D ribbon‐shaped flexible electronics.…”
Section: Introductionmentioning
confidence: 99%