Plating conditions significantly affect the reliability of components. Matter exchanges between the surface of components and the plating solution often occur during plating process owing to the corrosive characteristics of the latter, and this will lead to the production of excess ions and electrons and, subsequently, to electromigration. Reducing the plating current and shortening the plating time can inhibit the corrosion associated with the plating solution, and thus lengthen the life of components. Another approach is to increase sintering temperature, which can enhance the resistance of the surfaces of components to the plating solution, and thus also increase their lifespan. With regard to the cause of electromigration, the electric field might arise from the interaction between the magnetic field and the joule heat generated by the current load and ambient temperature during the test of the component lifespan.
Most commercial ZnO varistors containing Bi2O3 exhibit excellent varistor properties, but they
have a few drawbacks due to Bi2O3 having high volatility and reactivity and higher sintering temperature.
In this study, V2O5 is added as the varistor forming oxide to lower down the sintering temperature of ZnO
varistors for the further developing the chip Varistor array by using the Ag as the inner electrode. It is
found that the sintering temperature of V2O5-added ZnO will be lower down to about 600oC. But the
addition of V2O5 has no improvement in the electrical characteristics, and they need many additives to
obtain the high performance. For that, the nonlinear properties in these Varistors can be improved by
incorporation of some oxide additives. Different MnOx oxides (MnO, MnO2, and Mn3O4) and CoOx
oxides (CoO and Co3O4)are used as the minor oxide additives. The influences of different MnOx and
CoOx oxides on the nonlinear voltage–current density (V-I) characteristics and the nonlinear exponent (α)
of V2O5-ZnO varistor will be well developed.
The residual stress built up by sintering causes not only the destruction of the structure of magnetic components but also a reduction in their permeability. In this paper, the relationship between residual stress and permeability is examined, and two possible methods for improving this situation are presented. Because one of the causes of increased residual stress is competition between the shrinking behaviors from the silver and ceramic layers inside the components during sintering, the first method is changing the particle size of the silver paste to alter its shrinking behavior. The results show that choosing a finer silver particle paste as the inner electrode material can reduce the onset temperature of shrinkage of the silver layer and then separate the silver layer from the ceramic layer to shrink the layers individually, reducing the residual stress. The second method is based on the phenomenon of separate shrinking seen in the first method, and we used carbon paste as the isolation layer for the silver and ceramic layers to achieve this. The results show that this method can reduce the residual stress more than the first one, although it can cause a high direct current resistance (DCR) and a low bending strength, and other conditions should be considered in order to avoid these weaknesses.
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