Three-center versus four-center elimination in photolysis of vinyl fluoride and vinyl bromide at 193 nm: Bimodal rotational distribution of HF and HBr (v5) detected with time-resolved Fourier transform spectroscopy Following photodissociation of vinyl chloride at 193 nm, fully resolved vibration-rotational emission spectra of HCl in the spectral region 2000-3310 cm Ϫ1 are temporally resolved with a step-scan Fourier-transform spectrometer. Under improved resolution and sensitivity, emission from HCl up to vϭ7 is observed, with JϾ32 ͑limited by overlap at the band head͒ for vϭ1 -3. All vibrational levels show bimodal rotational distribution with one component corresponding to ϳ500 K and another corresponding to ϳ9500 K for vр4. Vibrational distributions of HCl for both components are determined; the low-J component exhibits inverted vibrational population of HCl. Statistical models are suitable for three-center ͑␣, ␣͒ elimination of HCl because of the loose transition state and a small exit barrier for this channel; predicted internal energy distributions of HCl are consistent but slightly less than those observed for the high-J component. Impulse models considering geometries and displacement vectors of transition states during bond breaking predict substantial rotational excitation for three-center elimination of HCl but little rotational excitation for four-center ͑␣, ␤͒ elimination; observed internal energy of the low-J component is consistent with that predicted for the four-center elimination channel. Rate coefficients 33.8 and 4.9ϫ10 11 s Ϫ1 for unimolecular decomposition predicted for three-center and four-center elimination channels, respectively, based on Rice-Ramsberger-Kassel-Marcus theory are consistent with the branching ratio of 0.81:0.19 determined by counting vibrational distribution of HCl to vр6 for high-J and low-J components. Hence we conclude that observed high-J and low-J components correspond to HCl (v, J) produced from three-center and four-center elimination channels, respectively.

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With the growing demand of multiprocessor system-onchip (MPSoC) and 3D IC technology evolution, it is crucial to address power and thermal issues during system architecture design. Electronic system level (ESL) design is an acknowledged effective methodology to explore system design by virtual platforms. However, and to our best knowledge, current ESL virtual platforms only consider the performance and power issues. Therefore, we propose a run-time system thermal analysis framework for applications to an ESL virtual platform in order to analyze the thermal issue at an abstract level. In the experiment, the average estimation error of temperature was 3.18%, while the maximal estimation error was only 6.36% for ANSYS ICEPAK. The framework thus can help system designers explore power and thermal management at the early stages of IC development.

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