Silver nanowires (Ag NWs) are key materials to fabricate next-generation flexible transparent electrodes (FTEs). Currently, the applications of Ag NWs are impeded by the large wire−wire contact resistance. Herein, a selflimited nanosoldering method is proposed to reduce the contact resistance by epitaxially depositing silver nanosolders at the Ag NW junctions, which have a negligible effect on the optical transparency, while decreasing the sheet resistance of the Ag NW film from 18.6 to 7.7 Ω/sq at a transmittance of 90%. In addition, the deposited nanosolders at the junctions remarkably improve the electrical and mechanical stabilities of the Ag NW electrodes. Notably, this simple nanosoldering process can be rapidly conducted under room temperature and ambient conditions and is free of any technical support or specific equipment. This technique is easily applied to the nanosoldering of 210 × 297 mm FTEs. Based on these FTEs, a high-performance flexible transparent heater with a sheet resistance 3.7 Ω/sq at a transmittance of 82.5% is constructed. Because of the high heating rate (4.8 °C/s), the heater can produce uniform heating (145 °C) at a short response time (30 s) and low input voltage (6 V).

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An adaptive pulse compression (APC) algorithm is developed, based on the concept of minimum mean square error (MMSE), that utilizes matched filter (MF) output as its input and is termed Matched-Filter-Reiterative-MMSE (MF-RMMSE). MF-RMMSE allows the use of a smaller processing window than traditional reiterative-MMSE (RMMSE) but achieves identical performance at side-lobe suppression, and thus the computational load is reduced. MF-RMMSE also facilitates the implementation of APC to current radar sensors, since the existing MF implementations can be untouched. The derivation of MF-RMMSE is provided in detail, andits performance is validated through both simulations and actual airborne radar measurements for "mixed-target" observations, which includes both hard targets and distributed weather targets.

Silver nanowires (AgNWs) are the most promising materials to fabricate flexible transparent electrodes (FTEs) that are used in next-generation electronics. However, there are several bottlenecks for AgNW-based FTEs to achieve large-scale applications, which include the thermal instability and rough surface topography of AgNWs and the poor interfacial adhesion between AgNWs and the used substrate. To simultaneously address these aforementioned issues, a robust and washable FTE is prepared based on a AgNW@TiO 2 core−shell network embedded in polyimide (PI) substrate through a facile and scalable solution-based process. After being treated with TiO 2 sol, an ultrathin, conformal, and continuous TiO 2 shell is coated on the AgNWs, which can effectively suppress the atomic surface diffusion. In comparison with a pristine AgNW network that breaks into nanorods and nanospheres at 250 °C for 10 min, the AgNW@TiO 2 core−shell network is stable at 300 °C, and its resistance just increases by a factor of 11 after being annealed at 400 °C for 1 h. Furthermore, the TiO 2 shell simultaneously increases the electrical and optical properties of the AgNW network. After PI precursors are flowed, dried, and thermally cured, the AgNW@TiO 2 core−shell network is embedded on the surface of the PI substrate with a surface roughness of 1.9 nm. In addition to high thermal stability, the conductivity of the AgNW@ TiO 2 −PI composite FTE remains almost unchanged after repeated peeling off cycles with 3M tape and mechanical bending cycles. It is also demonstrated that the AgNW@TiO 2 −PI composite FTE is washable, and the relative change in resistance (ΔR/R 0 ) is ∼12% after 100 washing cycles, in which a variety of stress situations occur in combination. KEYWORDS: AgNW@TiO 2 core−shell network, TiO 2 sol, flexible transparent electrodes, peeling off and mechanical stabilities, thermal and washing stabilities

An innovation application of doping conjugated polyaniline nano-dendrites (PANIs) into electrical conductive composites (ECCs) to prepare advanced flexible or stretchable printing circuits with better electrical conductivity and mechanical stability.