In photoelectrochemical (PEC) water splitting, BiVO4 is considered the most promising photoanode material among metal oxide semiconductors because of its relatively narrow optical bandgap and suitable band structure for water oxidation. Nevertheless, until now, the solar-to-hydrogen conversion efficiency of BiVO4 has shown significant limitations for commercialization because of its poor charge transport. Various strategies, including the formation of a heterojunction and doping of electron donors, have been implemented to enhance the charge transport efficiency; however, fundamental approaches are required for further enhancement. In this regard, we report the fundamental approach for BiVO4 thin film photoanodes by fabricating epitaxial oxide thin films with different crystallographic orientations for PEC water splitting. The crystalline anisotropy generally reveals distinct physical phenomena along different crystallographic orientations. In the same vein, in terms of the anisotropic properties of BiVO4, the electrical conductivity of BiVO4 is greater along the ab-plane than along the c-axis. Consequently, as the crystallographic orientation of the BiVO4 thin film changes from (001) to (010), the charge transport properties in the epitaxial BiVO4 thin film are significantly enhanced. Thus, at 1.23 VRHE, the photocurrent density of the epitaxial BiVO4 (010) thin film (2.29 mA cm–2) is much higher than that of the epitaxial BiVO4 (001) thin film (0.74 mA cm–2) because of significant enhancement in charge transport properties even for undoped BiVO4. These results strongly suggest that the growth of epitaxial BiVO4 thin films with specific crystallographic orientations has great potential to considerably improve the charge transport efficiency of photoanodes for solar water splitting.

Discrepant incidence has been reported regarding the incidence of herb-induced liver injury (HILI). To address the growing worldwide concern of HILI, we evaluated the risk of HILI in a nationwide prospective study. Between April 2013 and January 2016, 1001 inpatients (360 males and 641 females) from 10 tertiary hospitals throughout South Korea were treated with herbal drugs and had their liver enzymes periodically measured. A total of six patients met the criteria for HILI with RUCAM scores ranging from 4 to 7. All these participants were women and developed the hepatocellular type of HILI. One HILI participant met the criteria for Hy’s law; however, none of six cases presented clinical symptoms related to liver injury. This is the first nationwide prospective study that estimated the extent of the incidence of HILI [total: 0.60%, 95% confidence interval (CI) 0.12–1.08; women: 0.95%, 95% CI 0.19–1.68] and described its features in hospitalized participants.Electronic supplementary materialThe online version of this article (doi:10.1007/s00204-017-2007-9) contains supplementary material, which is available to authorized users.

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Ternary logic circuit has been studied for several decades because it can provide simpler circuits and subsequently lower power consumption via succinct interconnects. We demonstrated a ternary full adder exhibiting a low power-delay-product of ~10-16 J, which is comparable with the binary equivalent circuit. The ternary full adder was modeled using device parameters extracted from the experimentally demonstrated multi-Vth ternary graphene barristors.

As handheld electronic products are more prone to being dropped during useful life, package to board interconnect reliability has become a major concern for these products. This has prompted the industry to evaluate the drop performance of CSP packages while mounted on printed wiring boards using board level drop testing.Although a new board level test method has been standardized through JEDEC (JESD22-B111), characterization tests take quite a long time to complete, extending the design cycle. This paper proposes a method to compare and evaluate the drop performance through simulations at the design stage. A global-local approach is used to first determine the dynamic response of the board during drop and then to translate it into stresses and strain energy density in solder joints and intermetallic layers. The dynamic response of the board is validated by using data from actual board level testing as per JEDEC standard. The solder joint and intermetallic stresses are then related to drop to failure test data to derive a prediction model.The method is then applied to quantify the effect of package design parameters on the drop performance. Factors considered include material set, thickness of various material layers, pad size, and ball size. The same factors were tested in board level drop to further validate the prediction model. Experiments were also conducted to quantify the effects of package ball pad finish on the drop performance through board level testing according to JESD22-B111.The results indicate that the drop performance can be increased by a factor of 4 or more by changing package design and material variables.