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Dental caries is prevalent worldwide. Tooth cavity restorations cost more than $46 billion annually in the United States alone. The current generation of esthetic polymeric restorations have unsatisfactory failure rates. Replacing the failed restorations accounts for 50–70% of all the restorations. This article reviewed developments in producing a new generation of bioactive and therapeutic restorations. This includes: Protein-repellent and anti-caries polymeric dental composites, especially the use of 2-methacryloyloxyethyl phosphorylcholine (MPC) and dimethylaminododecyl methacrylate (DMAHDM); protein-repellent adhesives to greatly reduce biofilm acids; bioactive cements to inhibit tooth lesions; combining protein-repellency with antibacterial nanoparticles of silver; tooth surface coatings containing calcium phosphate nanoparticles for remineralization; therapeutic restorations to suppress periodontal pathogens; and long-term durability of bioactive and therapeutic dental polymers. MPC was chosen due to its strong ability to repel proteins. DMAHDM was selected because it had the most potent antibacterial activity when compared to a series of antibacterial monomers. The new generation of materials possessed potent antibacterial functions against cariogenic and periodontal pathogens, and reduced biofilm colony-forming units by up to 4 logs, provided calcium phosphate ions for remineralization and strengthening of tooth structures, and raised biofilm pH from a cariogenic pH 4.5 to a safe pH 6.5. The new materials achieved a long-term durability that was significantly beyond current commercial control materials. This new generation of bioactive and nanostructured polymers is promising for wide applications to provide therapeutic healing effects and greater longevity for dental restorations.

Abstract-Utilizing channel reciprocity, the traditional timereversal technique boosts the signal-to-noise ratio at the receiver with very low transmitter complexity. However, the large delay spread gives rise to severe inter-symbol interference (ISI) when the data rate is high, and the achievable transmission rate is further degraded in the multiuser downlink due to the interuser interference (IUI). In this work, we study the weighted sum rate optimization problem by means of waveform design in the time-reversal multiuser downlink where the receiver processing is based on a single sample. Power allocation has a significant impact on the waveform design problem. We propose a new power allocation algorithm named Iterative SINR Waterfilling, which is able to achieve comparable sum rate performance to that of globally optimal power allocation.

As handheld electronic products are more prone to being dropped during useful life, package to board interconnect reliability has become a major concern for these products. This has prompted the industry to evaluate the drop performance of CSP packages while mounted on printed wiring boards using board level drop testing.Although a new board level test method has been standardized through JEDEC (JESD22-B111), characterization tests take quite a long time to complete, extending the design cycle. This paper proposes a method to compare and evaluate the drop performance through simulations at the design stage. A global-local approach is used to first determine the dynamic response of the board during drop and then to translate it into stresses and strain energy density in solder joints and intermetallic layers. The dynamic response of the board is validated by using data from actual board level testing as per JEDEC standard. The solder joint and intermetallic stresses are then related to drop to failure test data to derive a prediction model.The method is then applied to quantify the effect of package design parameters on the drop performance. Factors considered include material set, thickness of various material layers, pad size, and ball size. The same factors were tested in board level drop to further validate the prediction model. Experiments were also conducted to quantify the effects of package ball pad finish on the drop performance through board level testing according to JESD22-B111.The results indicate that the drop performance can be increased by a factor of 4 or more by changing package design and material variables.

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