Ferroelectric aluminum scandium nitride (Al0.7Sc0.3N) has attracted increasing interest due to its high remanent polarization (Pr, >100 µC cm−2) and coercive field (Ec, >5 MV cm−1). The four radio frequency reactive magnetron sputtering conditions (sputtering power, N2 flow ratio, pressure, and temperature) influence the ferroelectric and material properties of 45 nm‐thick Al0.7Sc0.3N deposited on the TiN/SiO2/Si substrate. Crystallinity is enhanced under the deposition conditions with higher adatom energy but deteriorates when the growth condition increases over the optimum. The well‐crystallized films have (002)‐preferred orientation with the in‐plane compressive stress imposed by the peening effect and thermal stress. The imposed compressive stress increases the c0/a0 value, where c0 and a0 mean the c‐ and a–axis lattice parameters, which eventually increases the Ec of the film. Pr increases with the c0/a0 value, but other factors also influence the change. The films with high oxygen concentration show the wake‐up properties due to the large percentage of domain walls and their depinning. Finally, ferroelectricity is confirmed with films down to a thickness of 20 nm. However, the thinnest film shows a higher Ec and lower Pr. These findings imply the presence of non‐ferroelectric interfacial layers, which induce the depolarization effect.

This work investigates the evolution of the ferroelectric (FE) performance of the sputtered aluminum scandium nitride (AlScN) thin film, which has a high remanent polarization (Pr, > 100 µC cm−2) and coercive field (Ec, > 6 MV cm−1), with the electric field cycling. The work aims at elucidating the underlying origin of the severe fatigue behavior, even with a relatively small number of endurance cycles (<105). When cycled with a low electric field, an internal field is created by charges trapped between the FE layer and the interfacial dielectric layer (non‐FE). On the other hand, fatigue is observed when cycled with a high electric field cycling. This work proposes a new method to simulate a switching current utilizing an inhomogeneous field mechanism and the appropriate circuit model to assess the thickness change of the non‐FE layer. It is concluded that the thickened non‐FE layer after the field cycling results in fatigue.

Ti layer inserted in the TiN gate electrode effectively scavenges the oxygen in the low‐k interfacial SiO2 of the metal–ferroelectric–insulator–semiconductor (MFIS) capacitors with the ferroelectric Al‐doped HfO2 (HAO) thin film. The scavenging effect increases remanent polarization (Pr) and reduces coercive voltage (Vc) and capacitance equivalent thickness (CET) of the HAO films, particularly when the MFIS capacitor is annealed at 800 °C. Additionally, frequency dispersion of capacitance characteristics and interface trap density (Dit) calculations reveal that actively‐triggered oxygen‐scavenging effects also reduce defect or trap‐induced degradation. The Ti‐inserted MFIS structure exhibits fatigue‐free endurance and relatively low leakage current characteristics as compared to a structure without the Ti scavenging layer in high annealing temperature conditions required for crystallization of the HAO ferroelectric films.

This work systematically studies the TiN, Ru, and RuO2 top electrodes (TEs) effects on the ferroelectric properties of Hf0.5Zr0.5O2 (HZO) films. The Ru top electrode significantly improves the ferroelectric performance even with the conventional TiN bottom electrode. The high two‐remanent polarization (2Pr) value (≈65 µC cm−2) is obtained with the capacitor with Ru TE, which is ≈1.5 times higher than that of the capacitors with the TiN and RuO2 TEs. Moreover, it does not break down to 1 × 109 cycling with a high cycling electric field of 4.0 MV cm−1, while others do lower cycle numbers. Further enhancement can be achieved by inserting a 2‐nm‐thick HfON interfacial layer between the HZO film and TiN bottom electrode while keeping the Ru/HZO top interface structure. The capacitor does not break down even at an electric field strength of 4.8 MV cm−1, at which a 2Pr value of ≈67 µC cm−2 is achieved. Furthermore, it can endure 1 × 1011 switching cycles while a 2Pr value of 45–53 µC cm−2 is retained. Therefore, this study elucidates that interfacial engineering is an important technology that can overcome the trade‐off relationship between Pr and endurance, a critical issue in ferroelectric doped HfO2‐based films.

Fluorite structured ferroelectrics, such as (Hf, Zr)O2, attract much interest due to their scalability and compatibility with complementary metal‐oxide semiconductors, which make them superior to the conventional ferroelectrics. However, their reliability issues, including their limited endurance, are yet to be resolved. Such issues have been reported to be strongly correlated to the formation and drift of oxygen vacancies concentrated in the interfacial region adjacent to TiN electrodes. In this study, the effect of inserting a sacrificial HfO0.61N0.72 interfacial layer between a TiN bottom electrode and a ferroelectric Hf0.5Zr0.5O2 thin film is investigated. The insertion of the 2 nm‐thick HfO0.61N0.72 interfacial layer decreases the inclusion of the undesirable non‐ferroelectric phase by ≈60% and increases the remanent polarization by more than 30%. The reaction barrier property of the sacrificial HfO0.61N0.72 layer significantly enhances the reliability of the Hf0.5Zr0.5O2 film, and thus, improves the endurance of the film beyond 1.5 × 1011 switching cycles. This is the highest endurance among the reported values for fluorite‐structured ferroelectrics with the remanent polarization kept higher than 10 µC cm‐2.