Articles you may be interested inCompensation for transient chamber wall condition using real-time plasma density feedback control in an inductively coupled plasma etcher Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing O 2 and H 2 O as additive gases Point-of-use plasma abatement ͑PPA͒ has been proposed as one way to eliminate perfluorinated compound ͑PFC͒ emission from various tools used in integrated circuit manufacturing. PPA employs a high density plasma between the process tool turbomolecular pump and the backing pump. Oxygen is added to the process tool effluent upstream of the PPA tool. The mixture of oxygen and PFC-containing tool effluent enters the PPA tool and the PFCs are converted to products that can be scrubbed downstream of the backing pump. In this article, we present a model for the PPA tool operation, illustrating the principles with a mixture of C 2 F 6 /O 2 . A plasma model is coupled to a neutral transport and reaction model, including electron-impact molecular dissociation and subsequent gas phase chemistry.

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