Hydrogen-doped indium oxide (IO:H) has recently garnered attention as a high-performance transparent conducting oxide (TCO) and has been incorporated into a wide array of photovoltaic devices due to its high electron mobility (>100 cm2/V s) and transparency (>90% in the visible range). Here, we demonstrate IO:H thin-films deposited by sputtering with mobilities in the wide range of 10–100 cm2/V s and carrier densities of 4 × 1018 cm–3–4.5 × 1020 cm–3 with a large range of hydrogen incorporation. We use the temperature-dependent Hall mobility from 5 to 300 K to determine the limiting electron scattering mechanisms for each film and identify the temperature ranges over which these remain significant. We find that at high hydrogen concentrations, the grain size is reduced, causing the onset of grain boundary scattering. At lower hydrogen concentrations, a combination of ionized impurity and polar optical phonon scattering limits mobility. We find that the influence of ionized impurity scattering is reduced with the increasing hydrogen content, allowing a maximization of mobility >100 cm2/V s at moderate hydrogen incorporation amounts prior to the onset of grain boundary scattering. By investigating the parameter space of the hydrogen content, temperature, and grain size, we define the three distinct regions in which the grain boundary, ionized impurity, and polar optical phonon scattering operate in this high mobility TCO.

Recombination processes in passivated boron-implanted black silicon emitters In this paper, we study the recombination mechanisms in ion-implanted black silicon (bSi) emitters and discuss their advantages over diffused emitters. In the case of diffusion, the large bSi surface area increases emitter doping and consequently Auger recombination compared to a planar surface. The total doping dose is on the contrary independent of the surface area in implanted emitters, and as a result, we show that ion implantation allows control of emitter doping without compromise in the surface aspect ratio. The possibility to control surface doping via implantation anneal becomes highly advantageous in bSi emitters, where surface passivation becomes critical due to the increased surface area. We extract fundamental surface recombination velocities S n through numerical simulations and obtain the lowest values at the highest anneal temperatures. With these conditions, an excellent emitter saturation current (J 0e ) is obtained in implanted bSi emitters, reaching 20 fA/cm 2 6 5 fA/cm 2 at a sheet resistance of 170 X/sq. Finally, we identify the different regimes of recombination in planar and bSi emitters as a function of implantation anneal temperature. Based on experimental data and numerical simulations, we show that surface recombination can be reduced to a negligible contribution in implanted bSi emitters, which explains the low J 0e obtained. Published by AIP Publishing. [http://dx

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We present the concept of interference solar cells reliant on spectrum filtering or splitting to enhance absorption in thin (<13 µm) silicon absorber layers, both for targeted wavelengths and broadband absorption. Absorption enhancement in the long wavelength regime is achieved by fine-tuning of device layer thicknesses to provide destructive interference between reflected and escaped waves. We suggest this concept is also suitable for broadband absorption enhancement when combined with spectrum splitting optics through gradual thickness changes laterally across the device. Using the example of silicon heterojunction solar cells, we have computationally demonstrated a short circuit current density enhancement of 19% (from 25.8 mA/cm2 to 30.7 mA/cm2) compared to a silicon heterojunction cell of the same absorber layer thickness.

Abstract-Black silicon (b-Si) has been estimated to considerably grow its market share as a front texture of high-efficiency silicon solar cells. In addition to excellent optical properties, high-efficiency cell process requires extreme cleanliness of the bulk material, and thus cleaning of b-Si surfaces is often a critical process step. While standard clean (SC) 1 solution efficiently removes possible contamination from wafer surfaces, we show here that it may cause challenges in b-Si solar cells. First, the silicon etch rate in SC1 solution is shown to depend on the phosphorous concentration and as high rate as ∼1.4 nm/min is observed on planar emitter surfaces. When extending the study to b-Si, which has much larger surface area in contact with the cleaning solution, even higher volumetric Si consumption occurs. This is observed in significant changes in emitter doping profiles, for instance, a 10 and 30-min cleaning increases the sheet resistance from 47 to 57 Ω/ and 127 Ω/ , respectively. Furthermore, the SC1 solution alters substantially the nanostructure morphology, which impacts the optics by nearly doubling and more than tripling the surface reflectance after a 30 and 60-min immersion, respectively. Thus, uncontrolled cleaning times may impair both the electrical and optical properties of b-Si solar cells.