Photoluminescence (PL) of organo-metal halide perovskite semiconductors can be enhanced by several orders of magnitude by exposure to visible light. We applied PL microscopy and super-resolution optical imaging to investigate this phenomenon with spatial resolution better than 10 nm using films of CH3NH3PbI3 prepared by the equimolar solution-deposition method, resulting in crystals of different sizes. We found that PL of ∼100 nm crystals enhances much faster than that of larger, micrometer-sized ones. This crystal-size dependence of the photochemical light passivation of charge traps responsible for PL quenching allowed us to conclude that traps are present in the entire crystal volume rather than at the surface only. Because of this effect, "dark" micrometer-sized perovskite crystals can be converted into highly luminescent smaller ones just by mechanical grinding. Super-resolution optical imaging shows spatial inhomogeneity of the PL intensity within perovskite crystals and the existence of <100 nm-sized localized emitting sites. The possible origin of these sites is discussed.
We investigate the surface quality of encapsulated Si:P δ-layers for the fabrication of multilayer devices with the potential to create architectures with sub 20 nm resolution in all three spatial dimensions. We use scanning tunneling microscopy to investigate how the dopant incorporation chemistry of the first active layer strongly affects the quality of the Si encapsulation which serves as the regrowth interface for the second active layer. Low temperature Hall measurements of the encapsulated layers indicate full dopant activation for incorporation temperatures between 250–750 °C with 20% higher carrier densities than previously observed.
We develop a super-saturation technique to extend the previously established doping density limit for ultra-high vacuum monolayer doping of silicon with phosphorus. Through an optimized sequence of PH3 dosing and annealing of the silicon surface, we demonstrate a 2D free carrier density of ns = (3.6 ± 0.1) × 1014 cm−2, ∼50% higher than previously reported values. We perform extensive characterization of the dopant layer resistivity, including room temperature depth-dependent in situ four point probe measurements. The dopant layers remain conductive at less than 1 nm from the sample surface and importantly, surpass the semiconductor industry target for ultra-shallow junction scaling of <900 Ω◻−1 at a depth of 7 nm.
Atomic layer deposition (ALD) enables the ultrathin high-quality oxide layers that are central to all modern metal-oxide-semiconductor circuits. Crucial to achieving superior device performance are the chemical reactions during the first deposition cycle, which could ultimately result in atomic-scale perfection of the semiconductor–oxide interface. Here, we directly observe the chemical reactions at the surface during the first cycle of hafnium dioxide deposition on indium arsenide under realistic synthesis conditions using photoelectron spectroscopy. We find that the widely used ligand exchange model of the ALD process for the removal of native oxide on the semiconductor and the simultaneous formation of the first hafnium dioxide layer must be significantly revised. Our study provides substantial evidence that the efficiency of the self-cleaning process and the quality of the resulting semiconductor–oxide interface can be controlled by the molecular adsorption process of the ALD precursors, rather than the subsequent oxide formation.
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