We report a new lithography technique based on electromigration driven material transport for drawing patterns at nanometer scales in ambient conditions. We use a thin metal film as a masking layer and a polymer layer beneath it as a pattern transfer layer. The desired pattern is drawn in the metal layer by etching the metal with a conducting scanning probe assisted by liquid electromigration. The pattern drawn on the metal layer is transferred to the polymer layer by etching the polymer with an appropriate solvent. Subsequently, the pattern is transferred to the desired material layer using a film deposition technique followed by conventional lift-off process. Using this simple technique, we have achieved pattern resolutions of 9 nm on the polymer and 40 nm on transferring the pattern to another material. Based on the ease of use and process costs, this technique promises to be competitive to e-beam lithography that employs high energy and ultra-high vacuum, or the industrial standard ultra-violet light photolithography that employs extremely expensive implements to reach nano-scale resolutions. We also demonstrate direct mask writing using this technique and explain the fundamentals behind the workings of the developed method.

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Application of high electric-field between two points in a thin metallic film results in liquefaction and subsequent flow of the liquid-film from one electrode to another in a radially symmetric fashion. Here, we report the transition of the flow kinetics driven by the liquid film thickness varying from 3 to 100 nm. The mechanism of the flow behavior is observed to be independent of the film thickness; however, the kinetics of the flow depends on the film thickness and the applied voltage. An analytical model, incorporating viscosity and varying electrical resistivity with film thickness, is developed to explain the experimental observations.

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We report the first study on the formation of structures with micro- and nano-scopic periodic surface patterns created by the spontaneous flow of liquid metal over thin metallic solid films. Minute details of the flow of liquid gallium over gold are captured in situ at very high magnifications using a scanning electron microscope, and a series of experiments and microstructural characterization are performed to understand the underlying principles of the liquid flow and the pattern formation. This phenomenon is solely driven by wetting, with little influence of gravity, and is aided by a tenacious semi-solidus envelope of the intermetallic compound formed due to the reaction between the liquid metal and the metallic substrate. This complex flow creates highly periodic patterns with features ranging from hundreds of nanometers to tens of micrometers, which can be tuned a priori . We propose a model capturing the essential mechanics of the ripple formation and apply it to simulate the formation of a single ripple, along with its essential asymmetry, that forms the basis for generating the observed patterns.