2015
DOI: 10.1038/srep17753
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Electrolithography- A New and Versatile Process for Nano Patterning

Abstract: We report a new lithography technique based on electromigration driven material transport for drawing patterns at nanometer scales in ambient conditions. We use a thin metal film as a masking layer and a polymer layer beneath it as a pattern transfer layer. The desired pattern is drawn in the metal layer by etching the metal with a conducting scanning probe assisted by liquid electromigration. The pattern drawn on the metal layer is transferred to the polymer layer by etching the polymer with an appropriate so… Show more

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Cited by 27 publications
(45 citation statements)
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“…Currently, photolithography is the standard patterning technique in the industry and is the most reliable technique . However, the achievable resolution is limited and is unsuitable for nanoscale fabrication . For nanoscale lithography, the most common method is electron beam lithography (EBL) .…”
Section: Fabrication Methodsmentioning
confidence: 99%
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“…Currently, photolithography is the standard patterning technique in the industry and is the most reliable technique . However, the achievable resolution is limited and is unsuitable for nanoscale fabrication . For nanoscale lithography, the most common method is electron beam lithography (EBL) .…”
Section: Fabrication Methodsmentioning
confidence: 99%
“…Therefore, significant effort has been put into inventing alternative lithography techniques. A new lithography technique, electrolithography, has been proposed, and it is based on the electromigration of a liquid in thin metal films . Electromigration is a material‐transport process that is controlled by an electric current, and it can be used to generate hillocks and voids in metals …”
Section: Fabrication Methodsmentioning
confidence: 99%
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“…In the literature, several process variables have been considered to control and monitor the electromigration process in different devices, such as dr/dt, 15,16 (dr/dt)/r, 11,17 d(1/r)/dt, 6,18 or P r , 19 with r and P r as the resistance of and the dissipated power in the device, respectively. Although all these variables are related to the speed of electromigration, a solid motivation for the particular selected process variable is lacking in most references.…”
Section: Conceptual Description Of Electromigrationmentioning
confidence: 99%