A Schottky barrier high-electron-mobility avalanche transit time (HEM-ATT) structure is proposed for terahertz (THz) wave generation. The structure is laterally oriented and based on AlGaN/GaN two-dimensional electron gas (2-DEG). Trenches are introduced at different positions of the top AlGaN barrier layer for realizing different sheet carrier density profiles at the 2-DEG channel; the resulting devices are equivalent to high–low, low–high and low-high–low quasi-Read structures. The DC, large-signal and noise simulations of the HEM-ATTs were carried out using the Silvaco ATLAS platform, non-sinusoidal-voltage-excited large-signal and double-iterative field-maximum small-signal simulation models, respectively. The breakdown voltages of the devices estimated via simulation were validated by using experimental measurements; they were found to be around 17–18 V. Under large-signal conditions, the series resistance of the device is estimated to be around 20 Ω. The large-signal simulation shows that the HEM-ATT source is capable of delivering nearly 300 mW of continuous-wave peak power with 11% conversion efficiency at 1.0 THz, which is a significant improvement over the achievable THz power output and efficiency from the conventional vertical GaN double-drift region (DDR) IMPATT THz source. The noise performance of the THz source was found to be significantly improved by using the quasi-Read HEM-ATT structures compared to the conventional vertical Schottky barrier IMPATT structure. These devices are compatible with the state-of-the-art medium-scale semiconductor device fabrication processes, with scope for further miniaturization, and may have significant potential for application in compact biomedical spectroscopy systems as THz solid-state sources.
Utility of the reverse double-drift region (DDR) structure has been studied for fabricating the gallium nitride impact avalanche transit time (IMPATT) diode operating at 1.0 terahertz (THz). Static and largesignal simulations have been carried out in order to verify the THz capabilities of conventional (normal) and reverse DDR structures. It is revealed that IMPATT operation is only possible in a reverse GaN DDR structure due to the lower value of series resistance of it as compared to the normal GaN DDR structure. Normal DDR GaN IMPATT cannot be operational at THz regime. Earlier, the authors had calculated the series resistance of conventional GaN DDR IMPATT diode designed to operate at 1.0 THz, however. They did not take into account the current crowing and spreading resistance at the ohmic metal contacts. That is why, the results were misleading. Those results lead to the conclusion that conventional THz GaN DDR IMPATT may produce sufficient effective negative resistance since the series resistance of it remains within the range of 1.5-2.0 Ω. In this paper, authors have proposed a reverse DDR IMPATT structure exclusively for GaN material and THz frequency bands. By using this reverse DDR structure, p + -GaN ~ Ni/Au contact can obtain a sufficient contact area, so that the anode-contact resistance can be minimized. A nonsinusoidal voltage-excited large-signal model developed by the authors has been used to study the static (DC) and large-signal properties of conventional and reverse DDR structures at 1.0 THz. The present study on the evaluation of THz source seems to open a new horizon for THz researchers and scientists.
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