The aim of the study was to evaluate oxidative stress around parturition in normally calved and dystocia-affected buffaloes and the clinical efficacy of vitamin E and selenium (Se) in reducing the effects in buffaloes suffering from dystocia. Plasma cortisol concentration, erythrocytic malondialdehyde (MDA) level and superoxide dismutase (SOD) and glutathione peroxidase (GSH-Px) activities were evaluated in dystocia-affected (supplemented (n = 8) and unsupplemented (n = 5) with vitamin E and Se) and normally calved (unsupplemented; n = 6) buffaloes. The decline in plasma cortisol concentration, MDA level and SOD activity was greater in the group of dystocia-affected buffaloes supplemented with vitamin E and Se (78.62 +/- 2.7%, 13.38 +/- 9.75% and 28.83 +/- 7.72%, respectively) than in the unsupplemented group (54.33 +/- 12.62%, 3.48 +/- 4.16% and 17.69 +/- 12.93%, respectively). These results suggests that supplementation with antioxidants like vitamin E and Se may be beneficial in reducing oxidative stress in dystocia-affected buffaloes in the immediate postpartum period.
Many high strength aluminium engineering alloys cannot be joined by brazing because they either degrade or melt at the temperature at which commercially available aluminium brazes are used. A brazing process suitable for joining aluminium engineering alloys has been developed employing two novel low melting point brazes. The brazes are available as ductile foil preforms. The process is flux less and no post-joining cleaning treatments are necessary. The aluminium components and the brazing foil require a simple chemical treatment before use. The brazing process is tolerant and can be satisfactorily implemented by heating to a temperature of510-550°C, maintainedfor a period of5-45 min, in either vacuum or afurnace chamber that is purged continuously with nitrogen gas. The joints exhibit high strength and adequate resistance to corrosion for most applications. Some promising new applications for aluminium brazing technology based on this new process are described.MST/3183
The comparatively new process of diffusion soldering combines the
merits of Soldering and diffusion bonding. It is tolerant to surfaces that are not perfectly flat while, at flat
while, at the same time, it is capable of producing large‐area joints that are void free, a normal failing of
conventional soldering. Diffusion soldering processes have been successfully developed, based copper,
silver and gold. The metallurgical principles behind the design of these processes are explained and
prospective applications of each of the diffusion soldering systems are described. These range from the
attachment of heat‐sinks to silicon power devices, to jewellery and the fabrication of semiconductor
packaging.
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