Abstract:In this study, boron-containing primary amines were synthesized for use as building blocks in the study of peptoids. In the first step, Gabriel synthesis conditions were modified to enable the construction of seven different aminomethylphenyl boronate esters in good to excellent yields. These compounds were further utilized to build peptoid analogs via an Ugi four-component reaction (Ugi-4CR) under microwave irradiation. The prepared Ugi-4CR boronate esters were then successfully converted to the corresponding boronic acids. Finally, the peptoid structures were successfully modified by cross-coupling to aryl/heteroaryl chlorides via a palladium-mediated Suzuki coupling reaction to yield the corresponding derivatives in moderate to good yields.
Fine copper circuit on flexible substrate is highly demanded components for flexible displays. Two methods have been developed for making high resolution (7um, L/S) circuits with copper thickness up to 10 um: positive‐tone photolithography/wet etching, and semi‐additive photolithography/plating/flash etching processes. High throughput roll‐to‐roll process can be applied using both methods with proprietary positive‐tone photoresists for manufacturing flexible backplane and connector circuits.
For making a‐Si TFT array, fast photo‐speed positive photoresist with moderate taper angle profile is preferred. On the other hand, for making poly‐Si TFT, fast i‐line photo‐speed positive photoresist that shows a very vertical profile and has fine resolution is required. Because of the required performance is slightly different in a‐Si and poly‐Si TFT, different types of photoresist are usually used. This paper introduces a novel positive patterning photoresist that might be useful for both a‐Si and poly‐Si TFT manufacturing. This new type of positive photoresist shows fast photo‐speed and its pattern profile is vertical with very fine resolution. Under suitable process conditions, resolution down to 1um line and space is achieved even with contact aligner exposure. At the same time taper angle is controllable by choosing proper process conditions such as prebake temperature, inserting post exposure bake (PEB) process or not.
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