A study has been performed to determine the impact of package assembly on shear stress phenomena in plastic encapsulated integrated circuits (Ie's). Test structures were used which allowed quantitative measurements of compressive stresses along with qualitative observation of shear stress effects. Results from experiments with various mold compounds, lead frame materials, and mount compounds will be presented. The experiments led to the development of a simplified stress model which can be applied to evaluating package and chip designs of future products.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.