A comparison of radiated noise for Silicon and Silicon Carbide converters is presented. SiC JBS diodes were used in this evaluation to enable fast switching times, whilst minimizing the transistor junction temperature. Radiated electromagnetic-interference measurements showed the highest noise signature for the SiC JFET and lowest for the SiC MOSFET. The negative gate voltage requirement of the SiC MOSFET introduces up to 6 dBµV increase in radiated noise, due to the induced current in the high frequency resonant stray loop in the negative power plane of the gate drive. The SiC JFET and MOSFET have shown overall converter efficiencies of 96% and 95.5% respectively. This efficiency shows only a weak frequency dependence, in contrast to the CoolMOS/SiC JBS diode combination which demonstrated an efficiency drop from 95% to 92.5% when increasing the frequency from 100kHz to 250kHz.
Detectors capable of withstanding high radiation environments for prolonged periods of exposure are essential for the monitoring of nuclear power stations and nuclear waste as well as for space exploration. Schottky diode X-ray detectors were exposed to high dose proton irradiation (1013 cm-2, 50 MeV) and changes in the detection resolution (spectroscopic full width half-maximum) have been observed. Using Deep Level Transient Spectroscopy (DLTS) and the degradation of the electrical characteristics of the diode, we have shown that radiation induced traps located in the upper half of the bandgap have reduced the concentration of carriers.
Two sets of 4H-SiC signal-lateral JFETs were thermally aged at 400°C and 500°C in furnaces open to air for 1000 hours. I"-" V and low frequency noise measurements were performed on these devices and the results were compared against the as-fabricated sample. The data from I"-" V characterisation demonstrates that the linear and saturated drain-source current decreases monotonically with stress temperature. In addition, the linear characteristics of the JFETs have shifted approximately 1.5V along the drain-source voltage axis. Whilst the devices thermally aged at 400°C show no degradation in magnitude and behaviour in Noise Power Spectral Density (NPSD), the NPSD of 500°C stressed devices has increase approximately 30dB and it shows a full frequency spectrum of 1/ƒ dependency up to 100 kHz. A further investigation of the noise origin reveals that the Normalised Noise Power Spectral Density (NNPSD) of the aged sample is directly proportional to RDSwhich is similar to the as-fabricated sample. Thus we hypothesize that the existing noise sources have intensified possibly due to the evolution of defects.
The development of silicon carbide technologies has allowed for the development of sensors and electronics to measure the changes in a variety of hostile environments. A problem has been identified with reliable and efficient ways to power such sensors in these hostile environments. It is likely to be impractical to run power cables to these sensors and battery power has a finite lifetime. Recent research has demonstrated many energy scavenging techniques but to date none have been developed with a view of operation in hostile environments. To investigate the power density achievable from a SiC based energy scavenging device a SiC pin diode was exposed to both broad spectrum light form a tungsten halogen bulb and a 255 nm UV source. IV and CV measurements were used to determine the structural properties and photovoltaic response of the device, dark saturation current, induced photo current and the fill factor. We present the characteristics and maximum power density of these devices at temperatures between 300 K and 600 K. We demonstrate that the maximum power density achievable decreases with temperature. This is mostly due to the reduction in the built in potential from the pn junction, and the reduction of the generated photocurrent.
Low frequency noise on 4H-SiC low-level signal-lateral JFETs was systematically investigated. In contrast to previous studies, which are based upon high power vertical structures, this work investigates the low-frequency noise behaviour of low-level signal-lateral devices which are more relevant to the realisation of small signal amplifiers.The JFETs studied share an identical cross section, with different gate lengths and widths. For high temperature operation between 300K and 700K at VGS = 0V, the Normalised Power Spectral Density (NPSD) of the JFETs is proportional to ƒ-1. The NPSD increases monotonically with temperature until a critical temperature, where it starts to decline. Two unique noise origins, fluctuation from bulk and SiO2-SiC interface traps were observed across all the devices investigated. Low frequency noise for devices with a 50μm gate width is localised at the SiO2-SiC interface, whereas for wider devices the noise is seen to be of bulk/substrate origin, which follows Hooge’s model.
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