Scalable quantum networking requires quantum systems with quantum processing capabilities. Solid state spin systems with reliable spin–optical interfaces are a leading hardware in this regard. However, available systems suffer from large electron–phonon interaction or fast spin dephasing. Here, we demonstrate that the negatively charged silicon-vacancy centre in silicon carbide is immune to both drawbacks. Thanks to its 4 A 2 symmetry in ground and excited states, optical resonances are stable with near-Fourier-transform-limited linewidths, allowing exploitation of the spin selectivity of the optical transitions. In combination with millisecond-long spin coherence times originating from the high-purity crystal, we demonstrate high-fidelity optical initialization and coherent spin control, which we exploit to show coherent coupling to single nuclear spins with ∼1 kHz resolution. The summary of our findings makes this defect a prime candidate for realising memory-assisted quantum network applications using semiconductor-based spin-to-photon interfaces and coherently coupled nuclear spins.

We study the optical properties of tetravalent vanadium impurities in 4H silicon carbide (4H SiC). Emission from two crystalline sites is observed at wavelengths of 1.28 µm and 1.33 µm, with optical lifetimes of 163 ns and 43 ns. Group theory and ab initio density functional supercell calculations enable unequivocal site assignment and shed light on the spectral features of the defects. We conclude with a brief outlook on applications in quantum photonics. arXiv:1901.05371v2 [quant-ph]

We report on the electrical properties of Al2O3 films grown on 4H-SiC by successive thermal oxidation of thin Al layers at low temperatures (200°C - 300°C). MOS capacitors made using these films contain lower density of interface traps, are more immune to electron injection and exhibit higher breakdown field (5MV/cm) than Al2O3 films grown by atomic layer deposition (ALD) or rapid thermal processing (RTP). Furthermore, the interface state density is significantly lower than in MOS capacitors with nitrided thermal silicon dioxide, grown in N2O, serving as the gate dielectric. Deposition of an additional SiO2 film on the top of the Al2O3 layer increases the breakdown voltage of the MOS capacitors while maintaining low density of interface traps. We examine the origin of negative charges frequently encountered in Al2O3 films grown on SiC and find that these charges consist of trapped electrons which can be released from the Al2O3 layer by depletion bias stress and ultraviolet light exposure. This electron trapping needs to be reduced if Al2O3 is to be used as a gate dielectric in SiC MOS technology.

Highly resistive homoepitaxial layers of 4H-SiC have been grown on the Si-face of nominally on-axis, n-type substrates using chemical vapor deposition (CVD). Vanadium tetrachloride has been used as V-dopant which is responsible for the high resistivity of the epilayers. 100% 4H-polytype was reproduced in the epilayers using optimized on-axis growth process and the upper limit of Vanadium tetrachloride flow rate for achieving defect-free high resistivity homoepitaxial layers was established. A resistivity of more than 1x10 5 Ω-cm has been achieved in epilayers with a very low concentration of V (1x10 15 cm-3). Owing to the low concentration of V, superior epilayer structural quality was achieved compared to V-doped and standard high purity semi-insulating bulk grown material of similar resistivity. Epitaxial layers with varying Vanadium tetrachloride flow have also been grown to study the influence of V concentration on the polytype stability, structural quality and optical and electrical properties of epilayers. A clear correspondence has been observed in the flow-rates of Vanadium tetrachloride, the atomic concentration of V and electrical, optical and structural properties of epilayers.

On-axis homoepitaxy of 4H-SiC has the advantage of producing epilayers that are free of basal plane dislocations. Such layers can be highly beneficial for SiC-based high-power bipolar electronic devices which otherwise suffer from bipolar degradation phenomena related to basal plane dislocations in epilayers. In this study, we have developed on-axis homoepitaxy on the Si-face of 100 mm diameter 4H-SiC wafers with only 4H polytype in the epilayer excluding the edges of the wafer. We have also compared standard and chloride-based growth, the influence of different ambient conditions on surface preparation of the substrate, the influence of the histories of different growth cells, and the geometry of the susceptors regarding 4H-polytype stability in the epilayer. Substrate surface preparation, growth temperature, C/Si ratio, and Si/H ratio are found to be the most influential parameters to achieve homoepitaxy. On-axis homoepitaxial growth rate is limited to a very low value of <10 μm/h. We have performed a systematic study to understand the influence of different growth parameters and gas phase chemistries to determine whether on-axis growth rate can be enhanced and, if not, what the limiting factors are. Our experimental evidence suggests that the on-axis growth rate is not limited by the gas phase chemistry or diffusion, but it is limited by the surface kinetics. A significantly low step density on on-axis substrates lowers the surface reaction rates and limits the growth rate to lower values. It may not be possible to further improve the growth rate even with chloride-based growth using epitaxial growth conditions.