Considerable attention to coordinate the system between buyer and vendor has become an interesting issue to efficiently increase the performance of supply chain activities. Joint economic lot size model (JELS) has been introduced by many researchers as the spirit of coordinating the flow of material from the vendor to its downstream. As an inventory replenishment technique, JELS model is centered on reducing joint total cost of vendor and buyer by simultaneously deciding optimal delivery lot size, number of deliveries, and batch production lot. It is appropriate to take into account transportation costs as the function shipping weight and distance since delivery lot size has interrelated with shipping weight. Hence, this study constitutes an effort to develop the model of JELS by incorporating transportation cost. The solution procedure of the model is developed for solving two problems which are incapacitated and capacitated model. In addition, numerical examples were provided to illustrate the feasibility of the solution procedure in deriving optimal solution. The result presents central decision making which is useful for coordination and collaboration between vendor and buyer.
This paper deals with the problem of transportation and quality within a Just-in-Time (JIT) inventory replenishment system. Formerly, transportation and quality problem are often modelled separately in most integrated inventory lot-sizing models. Hence, this paper develops an integrated vendor-buyer lot-sizing model by considering transportation and quality improvements into a JIT environment. The model is developed for minimising a total vendor–buyer system cost by optimising decisions such as delivery quantity, production batch, number of shipments, and process quality. Numerical examples and sensitivity analysis are provided to illustrate the proposed model. The developed model was also compared with an enumeration method to analyse the effectiveness of the proposed model to find the optimum solution. The results emphasise that the proposed model contributes to a new approach and obtains a near optimum solution for inventory replenishment decisions. The results are also beneficial to JIT practices as the model can improve the transport payload and reduce the chance of defective products and improving quality-related costs.
Due to the importance of organizational management and human resources (HR) in the company, this study intends to analyze several aspects related to these two things, such as internal and external conditions of the company, existing business strategies, existing organizational structures, and job descriptions in a position. This research chooses one of the long-standing car alloy wheels industry. By conducting SWOT method, observations and interviews, there are some conclusions about the company's existing conditions and the formulation of new business strategies. The recommendations proposed in this study include to optimize opportunities and to strengthen the internal factors of the company (SO strategy), to design a new organizational structure with the addition of several specific positions, and to design HR strategies to be more competent.
The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB). The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP) machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm), and the solder height is the table speed of the SP machine (2.5 mm/s).
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