A new methodology and custom software tool is presented in this paper, which supports partial automation of designing and prototyping of electronic systems. The emphasis is put on component selection stage, which is realized in a substantially different way comparing to widely used parematric search engines. In presented approach besides of individual (component-level) parameters, also system-level constraints can be defined. As a result several sets of components fulfilling initial needs are automatically generated for further processing (i.e. system level modeling).Together with the use of parameterized circuit templates and integration with external simulation tools like SPICE presented methodology speeds-up designing of electronic systems thanks to semi-automatic selection of system components from thousands of possible choices.
Last decades in reliability prototyping of microelectronic devices show that from a long time there is no good solution to examine it in relatively short time and small expenditure of costs. Currently all thermo-mechanical reliability processes are long-lasting and costly. With using only the most dominating failure mode and cyclic loadings tests can last for a number of months. Companies, which produce their products very fast can't allow on such inconvenience, because this would lead to bankruptcy. To solve that kind of problem in this paper will be proposed new method of reliability investigating. Most of existing methods are concerned on only one failure mode which is dominating under selected loading conditions. Moreover all failure analysis are done under the simplified conditions what means that obtained results are not properly reliable. New presented method aim at using typical failure modes creep and fatigue at the same time while testing. That solution can have an important meaning in the standard Accelerated Thermal Cyclic test, which are based partly on experiment measurements and numerical analysis. Therefore appropriate understanding and development of analytical methods and experimental tools for multifailure criteria analysis could be very helpful. This work presents a methodology based on the use of well known indentation technique and second, innovative method with using new instrument called Failure And Reliability Investigation System created to study creep and fatigue phenomenon carried out on two lead-free alloys: SAC 405(S-SnAg4Cu0.5) and SAC 307(S-SnAg3Cu0.7)
In this paper authors present an improved design methodology consisting of methods and tools that are used to partially automate a task of smart sensor system design. By selecting a number of constraints and parameters of the whole sensor system (not only parameters of selected components), the application is able to generate set of results (each result is a set of components), which meet the pre-defined criteria. For example a designer selects only a range of pressure values that will be measured and an upper limit for current consumption of the whole system. The algorithm can choose combination(s) of integrated circuits according to the user defined requirements. Additionally application is able to evaluate the system performance, cost and assess element values for analog front-end circuit from pre-defined templates and provide SPICE netlist for further electric and / or thermal simulation.
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