The design and characterization in high-voltage (HV)-CMOS technology of an innovative intelligent power switch (IPS) for harsh automotive applications is proposed in this paper. To safely handle the ordinary and extraordinary automotive electrical and environmental conditions, a systematic design flow is followed: several design solutions are presented at the architectural and circuital level, integrating on-chip self-diagnostic capabilities and full protection against the high voltage and reverse polarity, the effects of wiring parasitics, and the over-current and over-temperature phenomena. Moreover, the current slope and soft start integrated techniques ensure a low electromagnetic interference, and the IPS is also configurable to efficiently drive different interchangeable loads. The innovative IPS has been implemented in a 0.35-mu m HV-CMOS technology and has been embedded in mechatronic third generation brush-holder regulator system-on-chip for an automotive alternator. The electrical simulations and experimental characterization and the testing at component and on-board system levels prove that the proposed design allows a compact and smart power switch realization facing the harshest automotive conditions
This paper presents the design, implementation, and validation of a FlexRay transceiver and a SpaceWire (SpW) router and interface, which constitute the main hardware building blocks of the two in-vehicle communication standards. The FlexRay protocol features data rates up to 10 Mb/s and time- and event-triggered transmissions, along with scalable fault-tolerance support, and it is expected to become the standard network for X-by-wire and active safety automotive systems. However, collision avoidance and driver-assistance applications based on camera/radar sensors require data rates up to hundreds of megabits per second as well as fault tolerance, features that can hardly be covered by current or expected automotive standards. In this scenario, a promising technology seems to be the new SpW protocol, currently used in avionics and aerospace
In the automotive electronic market, sensor conditioning is one of the driving applications. Sensor solutions are pervasive in the vehicle, while signal processing in such application is getting more and more complex. Currently the design strategy is often the standard ASIC flow, but the design effort can be reduced by automatic or platform-aided design strategies, or by using software-based solutions. In this paper SensASIP platform is presented. It is a design platform targeting a microprocessor architecture enhanced by dedicated instructions for computing intensive sensor signal processing tasks. SensASIP allows a seamless design flow from MATLAB-based algorithm definition and instruction set design and simulation, down to hardware macrocell HDL description and implementation in CMOS technology. SensASIP features are described through two automotive sensor conditioning examples. Special focus is put on its increased flexibility and reduced design-effort vs. standard ASIC design approach and on its low complexity overhead vs. other state-of-art software-based solution
In automotive field the signal processing algorithms implemented on chips is getting more and more complex. This is leading to a growing area of digital blocks of sensor systems and to greater digital design effort. The work presented in this paper has been started in order to have a flexible software-oriented DSP in portfolio, quickly customizable for the current product and with the minimum area overhead. The design platform has three levels: the instruction set emulator model for a fast algorithm implementation and the instruction set definition, the bit-true and cycle-true model of the processor for a fine verification of the application firmware, and the RTL design of a three-stage pipeline μ-processor. The instruction set and the hardware resources of the μ-processor are easily customizable. A case study, a design aided by the platform, is presented. Synthesis results are discussed, being the area constraint one of the most significant
This work aims to present an High Voltage High Power and High Frequency CMOS DC-DC converter able to work in both Flyback and Boost configurations, designed for automotive applications. The system, implemented in Austriamicrosystems 0.35um HVCMOS technology, is able to manage input voltages from 2.5V up to 36V and generates a programmable output voltage from 6 to 36V with an output current up to 900mA. To improve EMC/EMI system performances, dithering of switching frequency and slope controlling of the gate driver have been implemented.
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