In earlier days, welding only involves joining two metals of same kind and dissimilar metals were usually joined by fasteners. Friction Stud welding is a true engineering marvel of making welds between dissimilar metals without any melting or fillers involved. The friction stud welding doesn’t involve heat generation from electricity and it is purely based on friction. Besides these facts the friction stud welding has numerous advantage and applications. This paper focuses on the process of stud welding, application and its limitations.
Ceramic/metal joints are possible with silid state joining techniques. Transient liquid phase bonding is a solid state joining process which is choice process. In this paper, numerical simulation of TLP bonding of ceramic/metal is done by Finite Element simulation. The finite element analysis of the TLP process provides the temperature and residual stress distribution during the bonding. Aluminium sheet as interlayer having high wettability is used. Transient thermal analysis is performed and discussed.
In this work, an easy, reliable, effective approach for preparation of modified Boron Nitride (BN) from h-BN (Hexagonal boron nitride) was developed via liquid-phase exfoliation using a dopamine chemistry. Supramolecular interactions of the polydopamine (PDA) with h-BN has been used to achieve the facile surface modification of h-BN by forming a PDA shell on its surface. The successful and effective preparation of different h-BN-PDA hybrids has been confirmed by Scanning Electron Microscopy (SEM), Raman spectroscopy, XRD, IR and TGA investigations. The PDA coating increases the dispersibility of these hybrids as filler in polymers. Since polymer-based thermal interface materials (TIMs) with excellent thermal conductivity and electrical resistivity are in high demand, epoxy composites filled with h-BN, BBN (Ball milled Boron Nitride), MBN (Modified Boron Nitride) and MBBN (Modified Ball milled Boron Nitride) were processed. The thermal conductivity is as high as 4 W/mK for MBBN as compared with 0.2 W/mK of neat epoxy. This method of producing multifunctional exfoliated h-BN provides eco-friendly, easy handling, and suitable as a unique paradigm for developing the next generation of thermal conductive devices and solution-processed semiconductors.
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